年単位の研究成果
Fingerprint Eiji Iwaseが取り組む研究トピックをご確認ください。これらのトピックラベルは、この人物の研究に基づいています。これらを共に使用することで、固有の認識が可能になります。
Silicon
Engineering & Materials Science
Sensors
Engineering & Materials Science
Substrates
Engineering & Materials Science
Liquids
Engineering & Materials Science
Display devices
Engineering & Materials Science
Prisms
Engineering & Materials Science
membranes
Physics & Astronomy
Hydrogels
Engineering & Materials Science
ネットワーク
最近の共同研究。丸をクリックして詳細を確認しましょう。
研究成果 2002 2019
Design of microstructure for stimulating mechanical torque to cells
Nagase, H. & Iwase, E., 2019 1 1, BIODEVICES 2019 - 12th International Conference on Biomedical Electronics and Devices, Proceedings; Part of 12th International Joint Conference on Biomedical Engineering Systems and Technologies, BIOSTEC 2019. Roque, A., Fred, A. & Gamboa, H. (版). SciTePress, p. 215-219 5 p. (BIODEVICES 2019 - 12th International Conference on Biomedical Electronics and Devices, Proceedings; Part of 12th International Joint Conference on Biomedical Engineering Systems and Technologies, BIOSTEC 2019).研究成果: Conference contribution
Torque
Torsional stress
Microstructure
Magnetic fields
Ferromagnetic materials
Design of rigidity and breaking strain for a kirigami structure with non-uniform deformed regions
Taniyama, H. & Iwase, E., 2019 6 1, ： : Micromachines. 10, 6, 395.研究成果: Article
公開
Rigidity
Radially arranged dihedral corner reflector array for wide viewing angle of floating image without virtual image
Yoshimizu, Y. & Iwase, E., 2019 1 21, ： : Optics Express. 27, 2, p. 918-927 10 p.研究成果: Article
floating
reflectors
rays
evaluation
Resistance change mechanism of electronic component mounting through contact pressure using elastic adhesive
Sato, T., Koshi, T. & Iwase, E., 2019 6 1, ： : Micromachines. 10, 6, 396.研究成果: Article
公開
Mountings
Contact resistance
Adhesives
Copper
Electric wiring
Self-Healing Metal Interconnect for Flexible Electronic Device
Koshi, T. & Iwase, E., 2019 4 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 291-293 3 p. 8733474. (2019 International Conference on Electronics Packaging, ICEP 2019).研究成果: Conference contribution
Flexible electronics
Metals
Light emitting diodes
Regain
Metal nanoparticles