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次席研究員(研究院講師)

  • 151 引用
  • 8 h指数
20112019
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Fingerprint Fengwen Muが取り組む研究トピックをご確認ください。これらのトピックラベルは、この人物の研究に基づいています。これらを共に使用することで、固有の認識が可能になります。

  • 19 同様のプロファイル
Wafer bonding Engineering & Materials Science
Temperature Engineering & Materials Science
Sintering Engineering & Materials Science
Nanoparticles Engineering & Materials Science
Diamond Chemical Compounds
Electronics packaging Engineering & Materials Science
wafers Physics & Astronomy
Rapid thermal annealing Engineering & Materials Science

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研究成果 2011 2019

  • 151 引用
  • 8 h指数
  • 20 Conference contribution
  • 18 Article
  • 2 Review article

De-bondable SiC–SiC wafer bonding via an intermediate Ni nano-film

Mu, F., Uomoto, M., Shimatsu, T., Wang, Y., Iguchi, K., Nakazawa, H., Takahashi, Y., Higurashi, E. & Suga, T., 2019 1 28, : : Applied Surface Science. 465, p. 591-595 5 p.

研究成果: Article

Wafer bonding
Nickel
nickel
wafers
Silicon carbide

Direct wafer bonding of Ga2O3–SiC at room temperature

Xu, Y., Mu, F., Wang, Y., Chen, D., Ou, X. & Suga, T., 2019 4 1, : : Ceramics International. 45, 5, p. 6552-6555 4 p.

研究成果: Article

Wafer bonding
Annealing
Ion beams
Temperature
Thermal conductivity

GaN-SiC and GaN-diamond integration via room temperature bonding

Mu, F. & Suga, T., 2019 5 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735398. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Diamond
Diamonds
Temperature
Thermal conductivity
Substrates

High Thermal Boundary Conductance across Bonded Heterogeneous GaN-SiC Interfaces

Mu, F., Cheng, Z., Shi, J., Shin, S., Xu, B., Shiomi, J., Graham, S. & Suga, T., 2019 9 11, : : ACS applied materials & interfaces. 11, 36, p. 33428-33434 7 p.

研究成果: Article

Thermal conductivity
Substrates
Hot Temperature
Heat losses
Molecular beam epitaxy

Integration of GaN-SiC and GaN-diamond by surface activated bonding methods

Mu, F. & Suga, T., 2019 4 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 198-199 2 p. 8733419. (2019 International Conference on Electronics Packaging, ICEP 2019).

研究成果: Conference contribution

Diamond
Diamonds
Heat losses
Temperature