年別の研究成果
年別の研究成果
フィンガープリント
Hirofumi Shinoharaが活動している研究トピックを掘り下げます。このトピックラベルは、この研究者の研究成果に基づきます。これらがまとまってユニークなフィンガープリントを構成します。
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ネットワーク
国/地域レベルにおける最近の外部共同研究。点をクリックして詳細を開くか、または
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A 0.116pJ/bit Latch-Based True Random Number Generator with Static Inverter Selection and Noise Enhancement
Wang, X., Zhang, R., Wang, Y., Liu, K., Wang, X. & Shinohara, H., 2022, 2022 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2022 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2022 - Proceedings).研究成果: Conference contribution
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A 0.186-pJ per Bit Latch-Based True Random Number Generator Featuring Mismatch Compensation and Random Noise Enhancement
Zhang, R., Wang, X., Liu, K. & Shinohara, H., 2022 8月 1, In: IEEE Journal of Solid-State Circuits. 57, 8, p. 2498-2508 11 p.研究成果: Article › 査読
2 被引用数 (Scopus) -
A 2.17-pJ/b 5b-Response Attack-Resistant Strong PUF with Enhanced Statistical Performance
Liu, K., Li, G., Fu, Z., Wang, X. & Shinohara, H., 2022, ESSCIRC 2022 - IEEE 48th European Solid State Circuits Conference, Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 513-516 4 p. (ESSCIRC 2022 - IEEE 48th European Solid State Circuits Conference, Proceedings).研究成果: Conference contribution
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Statistical Modeling of SRAM PUF Cell Mismatch Shift Distribution after Hot Carrier Injection Burn-In
Liu, K., Takeuchi, K. & Shinohara, H., 2022, 2022 IEEE 34th International Conference on Microelectronic Test Structures, ICMTS 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (IEEE International Conference on Microelectronic Test Structures; vol. 2022-March).研究成果: Conference contribution
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36.3 A Modeling Attack Resilient Strong PUF with Feedback-SPN Structure Having <0.73% Bit Error Rate through In-Cell Hot-Carrier Injection Burn-In
Liu, K., Fu, Z., Li, G., Pu, H., Guan, Z., Wang, X., Chen, X. & Shinohara, H., 2021 2月 13, 2021 IEEE International Solid-State Circuits Conference, ISSCC 2021 - Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc., p. 502-504 3 p. 9365942. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 64).研究成果: Conference contribution
5 被引用数 (Scopus)