水野 潤

上級研究員(研究院教授)

  • 1416 引用
  • 19 h指数
19952019
Pureに変更を加えた場合、すぐここに表示されます。

研究成果 1995 2019

フィルター
Conference contribution
2019
1 引用 (Scopus)

Cu-Cu Quasi-Direct Bonding with Atomically Thin-Au and Pt Intermediate Layer Using Atomic Layer Deposition

Kuwae, H., Yamada, K., Momose, W., Shoji, S. & Mizuno, J., 2019 4 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 207-211 5 p. 8733483. (2019 International Conference on Electronics Packaging, ICEP 2019).

研究成果: Conference contribution

Atomic layer deposition
Metalloids
Beer
Metals
Temperature
1 引用 (Scopus)

High-aspect-ratio Sub-2-μm vias using thermal imprint with build-up resin

Kamibayashi, T., Kuwae, H., Kishioka, T., Usui, Y., Ohashi, T., Tamura, M., Shoji, S. & Mizuno, J., 2019 1 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 115-118 4 p. 8625825. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 巻数 2018-October).

研究成果: Conference contribution

Aspect ratio
Resins
Thermosets
Fillers
Silica

High-Color-Purity Microfluidic Quantum Dots Light-Emitting Diodes Using the Electroluminescence of the Liquid Organic Semiconductor Backlight

Kawamura, M., Kuwae, H., Kamibayashi, T., Oshima, J., Kasahara, T., Shoji, S. & Mizuno, J., 2019 6 1, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Institute of Electrical and Electronics Engineers Inc., p. 724-727 4 p. 8808557. (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII).

研究成果: Conference contribution

Organic Semiconductors
Electroluminescence
Semiconducting organic compounds
Microfluidics
organic semiconductors
1 引用 (Scopus)

Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition

Yamada, K., Kuwae, H., Kamibayashi, T., Momose, W., Shoji, S. & Mizuno, J., 2019 1 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 123-126 4 p. 8625756. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 巻数 2018-October).

研究成果: Conference contribution

Atomic layer deposition
Platinum
Copper
Temperature
Ultrathin films

New Era of Device Science

Kasahara, T., Kuwae, H. & Mizuno, J., 2019 4 22, 2019 Pan Pacific Microelectronics Symposium, Pan Pacific 2019. Institute of Electrical and Electronics Engineers Inc., 8696587. (2019 Pan Pacific Microelectronics Symposium, Pan Pacific 2019).

研究成果: Conference contribution

Organic light emitting diodes (OLED)
Nanotechnology
Semiconductor materials
NEMS
Luminescent devices

Study of Low-residual Stress Amorphous Film Deposition Method for LiTaO3/Quartz or LiNbO3/Quartz Bonding toward 5G Surface Acoustic Wave Devices

Tezuka, A., Kuwae, H., Yamada, K., Shoji, S., Kakio, S. & Mizuno, J., 2019 4 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 414-417 4 p. 8733501. (2019 International Conference on Electronics Packaging, ICEP 2019).

研究成果: Conference contribution

Acoustic surface wave devices
Quartz
Amorphous films
Residual stresses
Substrates

Study on role of inserted Pt intermediate layer deposited by atomic layer deposition for Cu-Cu quasi-direct bonding

Yamada, K., Kuwae, H., Kamibayashi, T., Shoji, S., Momose, W. & Mizuno, J., 2019 5 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735244. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Atomic layer deposition
2018

Control for Au-Ag Nanoporous Structure by Electrodeposition and Dealloying

Saito, M., Mizuno, J., Koga, S. & Nishikawa, H., 2018 11 26, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 8546350

研究成果: Conference contribution

Electrodeposition
Dissolution
Nanopores
Anodic polarization
Glow discharges

Fabrication of microchannel-TEM grid for in situ liquid observation of interfacial chemical reaction

Miwa, K., Kuwae, H., Sakamoto, K., Shoji, S. & Mizuno, J., 2018 6 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 284-287 4 p.

研究成果: Conference contribution

Microchannels
Chemical reactions
Transmission electron microscopy
Fabrication
Liquids
2 引用 (Scopus)

Longitudinal Leaky Surface Acoustic Wave with Low Attenuation on LiTaO3 Thin Plate Bonded to Quartz Substrate

Hayashi, J., Suzuki, M., Yonai, T., Yamaya, K., Kakio, S., Kishida, K., Asakawa, S., Kuwae, H. & Mizuno, J., 2018 12 17, 2018 IEEE International Ultrasonics Symposium, IUS 2018. IEEE Computer Society, 巻 2018-October. 8579715

研究成果: Conference contribution

thin plates
quartz
attenuation
acoustics
Q factors
2017
1 引用 (Scopus)

A study on low temperature SAM modified POM direct bonding affected by VUV/O3 irradiation

Fu, W., Ma, B., Kuwae, H., Shoji, S. & Mizuno, J., 2017 6 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., p. 69 1 p. 7947465

研究成果: Conference contribution

Self assembled monolayers
Irradiation
Surface treatment
Temperature
MEMS

Cu-Cu direct bonding by introducing Au intermediate layer

Noma, H., Kamibayashi, T., Kuwae, H., Suzuki, N., Nonaka, T., Shoji, S. & Mizuno, J., 2017 6 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., p. 70 1 p. 7947466

研究成果: Conference contribution

Gold
Fans

Deep-blue light emission with a wide-bandgap naphthalene-derivative liquid organic semiconductor host

Kobayashi, N., Kuwae, H., Oshima, J., Ishimatsu, R., Tashiro, S., Imato, T., Adachi, C., Shoji, S. & Mizuno, J., 2017, Organic Photonic Materials and Devices XIX 2017. SPIE, 巻 10101. 101011B

研究成果: Conference contribution

Organic Semiconductors
Blue Light
Semiconducting organic compounds
Light emission
organic semiconductors

Fabrication of self-standing curved film with pillar arrays by large area spherical soft-UV imprint lithography

Kamibayashi, T., Kuwae, H., Nobori, A., Shoji, S. & Mizuno, J., 2017 6 5, 2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc., p. 148-151 4 p. 7939344

研究成果: Conference contribution

Lithography
Fabrication
3D printers
Polydimethylsiloxane
Optical devices
10 引用 (Scopus)

High-coupling leaky SAWs on LiTaO3 thin plate bonded to quartz substrate

Hayashi, J., Gomi, M., Suzuki, M., Kakio, S., Suzaki, H., Yonai, T., Kishida, K. & Mizuno, J., 2017 10 31, 2017 IEEE International Ultrasonics Symposium, IUS 2017. IEEE Computer Society, 8091566

研究成果: Conference contribution

thin plates
quartz
acoustics
interdigital transducers
coefficients
1 引用 (Scopus)

High-coupling leaky SAWs on LiTaO3 thin plate bonded to quartz substrate

Hayashi, J., Gomi, M., Suzuki, M., Kakio, S., Suzaki, H., Yonai, T., Kishida, K. & Mizuno, J., 2017 10 31, 2017 IEEE International Ultrasonics Symposium, IUS 2017. IEEE Computer Society, 8091675

研究成果: Conference contribution

thin plates
quartz
acoustics
aluminum nitrides
phase velocity

Highly bendable transparent electrode using mesh patterned indium tin oxide for flexible electronic devices

Sakamoto, K., Kuwae, H., Kobayashi, N., Nobori, A., Shoji, S. & Mizuno, J., 2017 8 25, 2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2017. Institute of Electrical and Electronics Engineers Inc., p. 323-326 4 p. 8017034

研究成果: Conference contribution

Flexible electronics
Tin oxides
indium oxides
Indium
tin oxides

Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM)

Fu, W., Kuwae, H., Ma, B., Shoji, S. & Mizuno, J., 2017 6 5, 2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc., p. 167-170 4 p. 7939349

研究成果: Conference contribution

Self assembly
Monolayers
Electron devices
Temperature
Debonding
1 引用 (Scopus)

Widefield real-time single-cell secretion imaging with optical waveguide technique

Tanaka, Y., Suzuki, N., Mora, K., Mizuno, J., Shoji, S., Uemura, S. & Shirasaki, Y., 2017 7 26, TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems. Institute of Electrical and Electronics Engineers Inc., p. 1580-1583 4 p. 7994363

研究成果: Conference contribution

secretions
Optical waveguides
optical waveguides
Imaging techniques
cells
2016

Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach

Nishikawa, H., Matsunaga, K., Kim, M. S., Saito, M. & Mizuno, J., 2016, IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016. IMAPS-International Microelectronics and Packaging Society

研究成果: Conference contribution

Joining
Shear strength
Aging of materials
High temperature applications
Sintering

Flexible organic light emitting diode ribbons using three liquid organic semiconductors

Nobori, A., Kobayashi, N., Kuwae, H., Kasahara, T., Oshima, J., Adachi, C., Shoji, S. & Mizuno, J., 2016 11 28, 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016. Institute of Electrical and Electronics Engineers Inc., p. 38-41 4 p. 7758195

研究成果: Conference contribution

Semiconducting organic compounds
Organic light emitting diodes (OLED)
Microchannels
Liquids
Electroluminescence

Low Temperature Bonding between Polyether Ether Ketone (PEEK) and Pt through Vapor Assisted VUV Surface Modification

Fu, W., Shigetou, A., Shoji, S. & Mizuno, J., 2016 8 16, Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., 巻 2016-August. p. 2541-2546 6 p. 7545784

研究成果: Conference contribution

Polyether ether ketones
Surface treatment
Vapors
Medical applications
Hydrates

Low temperature direct bonding of PEEK and Pt through VUV/FAB surface treatments

Fu, W., Shigetou, A., Shoji, S. & Mizuno, J., 2016 6 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 302-305 4 p. 7486834

研究成果: Conference contribution

Polyether ether ketones
Surface treatment
Vacuum
Atoms
Hydrates
3 引用 (Scopus)

Low temperature direct bonding of single crystal quartz substrates for high performance optical low pass filter using amorphous SiO2 intermediate layers

Ma, B., Kuwae, H., Okada, A., Fu, W., Shoji, S. & Mizuno, J., 2016 2 26, MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., 巻 2016-February. p. 25-28 4 p. 7421548

研究成果: Conference contribution

Quartz
Optical filters
low pass filters
Low pass filters
quartz

Simultaneous fabrication of a through-glass interconnect via and bumps using dry filling process of submicron gold particles

Nomura, K., Okada, A., Shoji, S., Ogashiwa, T. & Mizuno, J., 2016 12 27, 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings. IEEE Computer Society, p. 270-272 3 p. 7799988

研究成果: Conference contribution

Gold
Fabrication
Glass
Photolithography
Sintering
1 引用 (Scopus)

ST-quartz/LiTaO3 direct bonding using SiO2 amorphous layers with VUV/O3 pre-treatment for a novel 5G surface acoustic wave device

Suzaki, H., Kuwae, H., Okada, A., Ma, B., Shoji, S. & Mizuno, J., 2016 6 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 443-446 4 p. 7486865

研究成果: Conference contribution

Acoustic surface wave devices
Quartz
Vacuum
Substrates
lithium tantalate oxide
1 引用 (Scopus)

Study of LiTaO3/ST-quartz Bonding with Amorphous Interlayer Assisted by VUV/O3 Treatment for SAW Device

Suzaki, H., Kuwae, H., Okada, A., Shoji, S. & Mizuno, J., 2016 12 27, 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings. IEEE Computer Society, p. 239-242 4 p. 7799986

研究成果: Conference contribution

Acoustic surface wave devices
Quartz
Substrates
Single crystals
Surface waves
1 引用 (Scopus)

VUV/O3 assisted single crystal quartz bonding with amorphous SiO2 intermedicate layer for manufacturing optical low pass filter

Ma, B., Kuwae, H., Okada, A., Fu, W., Shoji, S. & Mizuno, J., 2016 6 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 447-450 4 p. 7486866

研究成果: Conference contribution

Quartz
Optical filters
Low pass filters
Single crystals
Vacuum
2015

A double-sided in-plane lateral comb-drive actuator fabricated by a plaster-based 3D-printer

Mizuno, J. & Takahashi, S., 2015, Key Engineering Materials. Trans Tech Publications Ltd, 巻 656-657. p. 594-599 6 p. (Key Engineering Materials; 巻数 656-657).

研究成果: Conference contribution

3D printers
Plaster
Actuators
Fabrication
Electric potential
1 引用 (Scopus)

Effect of Au nanoporous structure on bonding strength

Matsunaga, K., Kim, M. S., Nishikawa, H., Saito, M. & Mizuno, J., 2015 5 20, ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., p. 830-833 4 p. 7111127

研究成果: Conference contribution

Joining
Nanoparticles
Binary alloys
Nanostructured materials
Shear strength

Fabrication of a hermetic sealing device having I-structure TGV filled with submicron gold particles

Nomura, K., Okada, A., Shoji, S., Ogashiwa, T. & Mizuno, J., 2015 12 23, 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 46-49 4 p. 7365176

研究成果: Conference contribution

Gold
Fabrication
Glass
Vacuum
Hermetic
1 引用 (Scopus)

Fabrication of a hermetic sealing device using low temperature intrinsic-silicon/glass bonding

Nomura, K., Mizuno, J., Okada, A., Shoji, S. & Ogashiwa, T., 2015 5 20, ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., p. 444-447 4 p. 7111054

研究成果: Conference contribution

Glass bonding
Fabrication
Glass
Silicon
Temperature
9 引用 (Scopus)

Hybrid bonding of Cu/Sn microbump and adhesive with silica filler for 3D interconnection of single micron pitch

Ohyama, M., Nimura, M., Mizuno, J., Shoji, S., Tamura, M., Enomoto, T. & Shigetou, A., 2015 7 15, Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., 巻 2015-July. p. 325-330 6 p. 7159612

研究成果: Conference contribution

Silicon Dioxide
Fillers
Adhesives
Silica
Resins
2 引用 (Scopus)

Improved low temperature gold-gold bonding using nanoporous powder bump using vacuum ultraviolet irradiation pre-treatment

Kaneda, T., Mizuno, J., Okada, A., Matsunaga, K., Shoji, S., Saito, M. & Nishikawa, H., 2015 5 20, ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., p. 473-477 5 p. 7111061

研究成果: Conference contribution

Gold
Irradiation
Vacuum
Powders
Ligaments

Improvement of surface properties on microfluidic devices by Diamond-Like Carbon coatings

Murayama, Y., Shiba, K., Ohgoe, Y., Mizuno, J., Shoji, S., Ozeki, K., Sato, K., Alanazi, A. & Hirakuri, K., 2015 5 20, ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., p. 874-877 4 p. 7111138

研究成果: Conference contribution

Diamond like carbon films
Microfluidics
Surface properties
Diamonds
Chemical stability

Light trapping of organic solar cells by nanotextured surfaces

Kubota, S., Kanomata, K., Ahmmad, B., Mizuno, J. & Hirose, F., 2015 5 20, ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., p. 428-431 4 p. 7111050

研究成果: Conference contribution

Texturing
Finite difference time domain method
Global optimization
Short circuit currents
Current density
2 引用 (Scopus)

Low temperature direct bonding of polyether ether ketone (PEEK) and Pt

Fu, W., Shigetou, A., Shoji, S. & Mizuno, J., 2015 12 23, 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 217-220 4 p. 7365179

研究成果: Conference contribution

Polyether ether ketones
Temperature
Vacuum
Interfacial energy
Hydroxyl Radical

Microfluidic white organic light-emitting diode based on striped fine microchannels for greenish blue and yellow liquid emitters

Kobayashi, N., Kasahara, T., Edura, T., Oshima, J., Ishimatsu, R., Tsuwaki, M., Imato, T., Shoji, S. & Mizuno, J., 2015 8 5, 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015. Institute of Electrical and Electronics Engineers Inc., p. 2049-2052 4 p. 7181359

研究成果: Conference contribution

Organic light emitting diodes (OLED)
microchannels
Microchannels
Microfluidics
emitters

Vacuum ultraviolet (VUV) and vapor-combined surface modification for hybrid bonding at low temperature and atmospheric pressure

Shigetou, A., Mizuno, J. & Shoji, S., 2015 5 20, ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., p. 239-242 4 p. 7111030

研究成果: Conference contribution

Atmospheric pressure
Surface treatment
Vapors
Vacuum
Hydrates
5 引用 (Scopus)

Vacuum ultraviolet (VUV) and vapor-combined surface modification for hybrid bonding of SiC, GaN, and Si substrates at low temperature and atmospheric pressure

Shigetou, A., Mizuno, J. & Shoji, S., 2015 7 15, Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., 巻 2015-July. p. 1498-1501 4 p. 7159796

研究成果: Conference contribution

Atmospheric pressure
Surface treatment
Vapors
Vacuum
Semiconductor materials
2014

Fast and simultaneous analysis of phenylalanine and tyrosine in plasma using pillar array columns with a gradient elution system

Isokawa, M., Song, Y., Takatsuki, K., Sekiguchi, T., Mizuno, J., Funatsu, T., Shoji, S. & Tsunoda, M., 2014, 18th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2014. Chemical and Biological Microsystems Society, p. 941-943 3 p.

研究成果: Conference contribution

Plasmas
Liquid chromatography
Biomarkers
Screening
4 引用 (Scopus)

Fine-pitch hybrid bonding with Cu/Sn microbumps and adhesive for high density 3D integration

Ohyama, M., Mizuno, J., Shoji, S., Nimura, M., Nonaka, T., Shinba, Y. & Shigetou, A., 2014, 2014 International Conference on Electronics Packaging, ICEP 2014. IEEE Computer Society, p. 604-607 4 p. 6826751

研究成果: Conference contribution

Adhesives
Electron microscopes
Scanning
Chemical mechanical polishing
Intermetallics

Fine-pitch interconnection by hybrid Cu/Sn-adhesive bonding for 3D integration

Ohyama, M., Mizuno, J., Shoji, S., Nimura, M., Nonaka, T., Shinba, Y. & Shigetou, A., 2014, Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. IEEE Computer Society, p. 48 1 p. 6886187

研究成果: Conference contribution

Adhesives
Chemical mechanical polishing
Metals
Scanning
Electrons
1 引用 (Scopus)

Flexible and capacitive tactile sensor sheet

Mizushima, M., Takagi, S., Itano, H., Obata, T., Kasahara, T., Shoji, S. & Mizuno, J., 2014, 2014 International Conference on Electronics Packaging, ICEP 2014. IEEE Computer Society, p. 756-759 4 p. 6826783

研究成果: Conference contribution

Sensors
Silicone Elastomers
Electrodes
Polyethylene Terephthalates
Screen printing
1 引用 (Scopus)

Hemocompatibility of DLC coating for blood analysis devices

Shiba, K., Ohgoe, Y., Hirakuri, K., Mizuno, J., Shoji, S., Ozeki, K., Sato, K., Fukata, N. & Alanazi, A., 2014, 2014 International Conference on Electronics Packaging, ICEP 2014. IEEE Computer Society, p. 748-751 4 p. 6826781

研究成果: Conference contribution

Cycloparaffins
Diamond
Polydimethylsiloxane
Olefins
Diamonds

Low temperature and low pressure bump bonding realized by single-micrometer Ag-nanoparticle bumps

Fu, W., Kasahara, T., Okada, A., Shoji, S., Shigetou, A. & Mizuno, J., 2014, Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. IEEE Computer Society, p. 47 1 p. 6886186

研究成果: Conference contribution

Nanoparticles
Compressive stress
Temperature
5 引用 (Scopus)

Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects

Mimatsu, H., Mizuno, J., Kasahara, T., Saito, M., Shoji, S. & Nishikawa, H., 2014, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). Institute of Electrical and Electronics Engineers Inc., p. 1131-1134 4 p. 6765845

研究成果: Conference contribution

Gold
Powders
gold
Temperature
Acoustic microscopes
6 引用 (Scopus)

Microfluidic electrochemiluminescence (ECL) integrated flow cell for portable fluorescence detection

Tsuwaki, M., Mizuno, J., Kasahara, T., Edura, T., Kunisawa, E., Ishimatsu, R., Matsunami, S., Imato, T., Adachi, C. & Shoji, S., 2014, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). Institute of Electrical and Electronics Engineers Inc., p. 108-111 4 p. 6765585

研究成果: Conference contribution

Microfluidics
Fluorescence
fluorescence
cells
chips
1 引用 (Scopus)

Nano-porous structure control under electrodeposition and dealloying conditions for low-temperature bonding

Saito, M., Matsunaga, K., Mizuno, J. & Nishikawa, H., 2014 11 18, Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014. Institute of Electrical and Electronics Engineers Inc., 6962819

研究成果: Conference contribution

Electrodeposition
Ligaments
Temperature
Inductively coupled plasma mass spectrometry
Dissolution

Nonlinear optical property of CNT embedded in Si slot waveguide

Fukuda, K., Yamada, S., Kuwae, H., Mizuno, J., Takashima, T., Matsushima, Y. & Utaka, K., 2014, 2014 OptoElectronics and Communication Conference, OECC 2014 and Australian Conference on Optical Fibre Technology, ACOFT 2014. IEEE Computer Society, p. 1041-1042 2 p. 6888365

研究成果: Conference contribution

Carbon nanotubes
Waveguides
Optical properties