年別の研究成果
年別の研究成果
研究成果
- 1 被引用数
- 1 h-index
- 3 Conference contribution
検索結果
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2020
An Embedded SiC Module with Using NMPB Interconnection for Chevron Shaped Cu Lead and Electrodes
Fukui, N., Koshiba, K., Miyazaki, I., Morisako, I., Iizuka, T., Itose, T., Hikita, M., Kamimura, R. & Tatsumi, K., 2020 6, Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 2226-2229 4 p. 9159375. (Proceedings - Electronic Components and Technology Conference; vol. 2020-June).研究成果: Conference contribution
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2019
High temperature resistant packaging technology for SiC power module by using Ni micro-plating bonding
Tatsumi, K., Morisako, I., Wada, K., Fukuomori, M., Iizuka, T., Sato, N., Shimizu, K., Ueda, K., Hikita, M., Kamimura, R., Kawanabe, N., Sugiura, K., Tsuruta, K. & Toda, K., 2019 5, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers Inc., p. 1451-1456 6 p. 8811270. (Proceedings - Electronic Components and Technology Conference; vol. 2019-May).研究成果: Conference contribution
1 被引用数 (Scopus) -
2018
High temperature resistant interconnection for SiC power devices using Ni micro-electroplating and Ni nano particles
Tatsumi, K., Tanaka, Y., Iizuka, T., Wada, K., Fukumori, M., Morisako, I., Jeongbin, Y. & Murakawa, N., 2018 11 26, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 8546378研究成果: Conference contribution