年単位の研究成果
Fingerprint Kohei Tatsumiが取り組む研究トピックをご確認ください。これらのトピックラベルは、この人物の研究に基づいています。これらを共に使用することで、固有の認識が可能になります。
Soldering alloys
Engineering & Materials Science
Intermetallics
Engineering & Materials Science
Wire
Engineering & Materials Science
Plating
Engineering & Materials Science
intermetallics
Physics & Astronomy
Gold
Engineering & Materials Science
Packaging
Engineering & Materials Science
solders
Physics & Astronomy
ネットワーク
最近の共同研究。丸をクリックして詳細を確認しましょう。
研究成果 1986 2019
1
引用
(Scopus)
Development and evaluation of SiC inverter using Ni micro plating bonding power module
Kawagoe, A., Itose, T., Imakiire, A., Kozako, M., Hikita, M., Tatsumi, K., Iizuka, T., Morisako, I., Sato, N., Shimizu, K., Ueda, K., Sugiura, K., Tsuruta, K. & Toda, K., 2019 4 1, 2019 IEEE International Workshop on Integrated Power Packaging, IWIPP 2019. Institute of Electrical and Electronics Engineers Inc., p. 36-39 4 p. 8799079. (2019 IEEE International Workshop on Integrated Power Packaging, IWIPP 2019).研究成果: Conference contribution
Plating
Silicon carbide
Insulated gate bipolar transistors (IGBT)
Packaging
Temperature
High temperature resistant packaging technology for SiC power module by using Ni micro-plating bonding
Tatsumi, K., Morisako, I., Wada, K., Fukuomori, M., Iizuka, T., Sato, N., Shimizu, K., Ueda, K., Hikita, M., Kamimura, R., Kawanabe, N., Sugiura, K., Tsuruta, K. & Toda, K., 2019 5 1, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers Inc., p. 1451-1456 6 p. 8811270. (Proceedings - Electronic Components and Technology Conference; 巻数 2019-May).研究成果: Conference contribution
Plating
Packaging
Nickel
Temperature
Lead
Thermal resistance and transient thermal analysis of sic power module using ni micro plating bonding
Imakiire, A., Kozako, M., Hikita, M., Tatsumi, K., Inagaki, M., Iizuka, T., Sato, N., Shimizu, K., Ueda, K., Sugiura, K., Tsuruta, K. & Toda, K., 2019 1 1, ： : ieej transactions on industry applications. 139, 10, p. 838-846 9 p.研究成果: Article
Plating
Heat resistance
Thermoanalysis
Nickel
Soldering alloys
High temperature resistant interconnection for SiC power devices using Ni micro-electroplating and Ni nano particles
Tatsumi, K., Tanaka, Y., Iizuka, T., Wada, K., Fukumori, M., Morisako, I., Jeongbin, Y. & Murakawa, N., 2018 11 26, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 8546378研究成果: Conference contribution
Electroplating
Silicon carbide
Temperature
Nickel
Plating
6
引用
(Scopus)
Development of Packaging Technology for High Temperature Resistant SiC Module of Automobile Application
Tatsumi, K., Inagaki, M., Kamei, K., Iizuka, T., Narimatsu, H., Sato, N., Shimizu, K., Ueda, K., Imakire, A., Hikita, M., Kamimura, R., Sugiura, K., Tsuruta, K. & Toda, K., 2017 8 1, Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017. Institute of Electrical and Electronics Engineers Inc., p. 1316-1321 6 p. 7999851研究成果: Conference contribution
Nickel
Mountings
Plating
Automobiles
Packaging