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Fingerprint Kohei Tatsumiが取り組む研究トピックをご確認ください。これらのトピックラベルは、この人物の研究に基づいています。これらを共に使用することで、固有の認識が可能になります。

Soldering alloys Engineering & Materials Science
Intermetallics Engineering & Materials Science
Wire Engineering & Materials Science
Plating Engineering & Materials Science
intermetallics Physics & Astronomy
Gold Engineering & Materials Science
Packaging Engineering & Materials Science
solders Physics & Astronomy

ネットワーク 最近の共同研究。丸をクリックして詳細を確認しましょう。

研究成果 1986 2019

  • 537 引用
  • 13 h指数
  • 29 Article
  • 27 Conference contribution
  • 1 Chapter
1 引用 (Scopus)

Development and evaluation of SiC inverter using Ni micro plating bonding power module

Kawagoe, A., Itose, T., Imakiire, A., Kozako, M., Hikita, M., Tatsumi, K., Iizuka, T., Morisako, I., Sato, N., Shimizu, K., Ueda, K., Sugiura, K., Tsuruta, K. & Toda, K., 2019 4 1, 2019 IEEE International Workshop on Integrated Power Packaging, IWIPP 2019. Institute of Electrical and Electronics Engineers Inc., p. 36-39 4 p. 8799079. (2019 IEEE International Workshop on Integrated Power Packaging, IWIPP 2019).

研究成果: Conference contribution

Plating
Silicon carbide
Insulated gate bipolar transistors (IGBT)
Packaging
Temperature

High temperature resistant packaging technology for SiC power module by using Ni micro-plating bonding

Tatsumi, K., Morisako, I., Wada, K., Fukuomori, M., Iizuka, T., Sato, N., Shimizu, K., Ueda, K., Hikita, M., Kamimura, R., Kawanabe, N., Sugiura, K., Tsuruta, K. & Toda, K., 2019 5 1, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers Inc., p. 1451-1456 6 p. 8811270. (Proceedings - Electronic Components and Technology Conference; 巻数 2019-May).

研究成果: Conference contribution

Plating
Packaging
Nickel
Temperature
Lead

Thermal resistance and transient thermal analysis of sic power module using ni micro plating bonding

Imakiire, A., Kozako, M., Hikita, M., Tatsumi, K., Inagaki, M., Iizuka, T., Sato, N., Shimizu, K., Ueda, K., Sugiura, K., Tsuruta, K. & Toda, K., 2019 1 1, : : ieej transactions on industry applications. 139, 10, p. 838-846 9 p.

研究成果: Article

Electric power systems
Plating
Heat resistance
Thermoanalysis
Nickel

High temperature resistant interconnection for SiC power devices using Ni micro-electroplating and Ni nano particles

Tatsumi, K., Tanaka, Y., Iizuka, T., Wada, K., Fukumori, M., Morisako, I., Jeongbin, Y. & Murakawa, N., 2018 11 26, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 8546378

研究成果: Conference contribution

Electroplating
Silicon carbide
Temperature
Nickel
Plating
6 引用 (Scopus)

Development of Packaging Technology for High Temperature Resistant SiC Module of Automobile Application

Tatsumi, K., Inagaki, M., Kamei, K., Iizuka, T., Narimatsu, H., Sato, N., Shimizu, K., Ueda, K., Imakire, A., Hikita, M., Kamimura, R., Sugiura, K., Tsuruta, K. & Toda, K., 2017 8 1, Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017. Institute of Electrical and Electronics Engineers Inc., p. 1316-1321 6 p. 7999851

研究成果: Conference contribution

Nickel
Mountings
Plating
Automobiles
Packaging