Park, B.,
le Han, D.,
Saito, M.,
Mizuno, J. &
Nishikawa, H.,
2021 5月 12,
2021 International Conference on Electronics Packaging, ICEP 2021. Institute of Electrical and Electronics Engineers Inc.,
p. 159-160 2 p. 9451968. (2021 International Conference on Electronics Packaging, ICEP 2021).
研究成果: Conference contribution