• 792 引用
  • 14 h指数
19942019
Pureに変更を加えた場合、すぐここに表示されます。

Fingerprint Nozomu Togawaが取り組む研究トピックをご確認ください。これらのトピックラベルは、この人物の研究に基づいています。これらを共に使用することで、固有の認識が可能になります。

  • 6 同様のプロファイル
Hardware Engineering & Materials Science
Networks (circuits) Engineering & Materials Science
Field programmable gate arrays (FPGA) Engineering & Materials Science
Cryptography Engineering & Materials Science
High-level Synthesis Mathematics
Routing algorithms Engineering & Materials Science
Clocks Engineering & Materials Science
Data storage equipment Engineering & Materials Science

ネットワーク 最近の共同研究。丸をクリックして詳細を確認しましょう。

研究成果 1994 2019

Reference Point
User Preferences
Search Methods
公開
Field programmable gate arrays (FPGA)
Networks (circuits)

Capacitance Measurement of Running Hardware Devices and its Application to Malicious Modification Detection

Nishizawa, M., Hasegawa, K. & Togawa, N., 2019 1 8, 2018 IEEE Asia Pacific Conference on Circuits and Systems, APCCAS 2018. Institute of Electrical and Electronics Engineers Inc., p. 362-365 4 p. 8605668. (2018 IEEE Asia Pacific Conference on Circuits and Systems, APCCAS 2018).

研究成果: Conference contribution

Capacitance measurement
hardware
Capacitance
capacitance
Hardware

Efficient Ising Model Mapping to Solving Slot Placement Problem

Kanamaru, S., Oku, D., Tawada, M., Tanaka, S., Hayashi, M., Yamaoka, M., Yanagisawa, M. & Togawa, N., 2019 3 6, 2019 IEEE International Conference on Consumer Electronics, ICCE 2019. Institute of Electrical and Electronics Engineers Inc., 8661947. (2019 IEEE International Conference on Consumer Electronics, ICCE 2019).

研究成果: Conference contribution

Ising model
Combinatorial optimization
Hamiltonians
Electric wiring
Simulated annealing

Landmark Seasonal Travel Distribution and Activity Prediction Based on Language-specific Analysis

Bao, S., Yanagisawa, M. & Togawa, N., 2019 1 22, Proceedings - 2018 IEEE International Conference on Big Data, Big Data 2018. Song, Y., Liu, B., Lee, K., Abe, N., Pu, C., Qiao, M., Ahmed, N., Kossmann, D., Saltz, J., Tang, J., He, J., Liu, H. & Hu, X. (版). Institute of Electrical and Electronics Engineers Inc., p. 3628-3637 10 p. 8622103. (Proceedings - 2018 IEEE International Conference on Big Data, Big Data 2018).

研究成果: Conference contribution

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