• 4345 引用
  • 33 h指数
1981 …2019
Pureに変更を加えた場合、すぐここに表示されます。

Fingerprint Shuichi Shojiが取り組む研究トピックをご確認ください。これらのトピックラベルは、この人物の研究に基づいています。これらを共に使用することで、固有の認識が可能になります。

  • 4 同様のプロファイル
Microfluidics Engineering & Materials Science
Fabrication Engineering & Materials Science
Microchannels Engineering & Materials Science
Sorting Engineering & Materials Science
Glass Engineering & Materials Science
Sensors Engineering & Materials Science
Vacuum Engineering & Materials Science
Temperature Engineering & Materials Science

ネットワーク 最近の共同研究。丸をクリックして詳細を確認しましょう。

研究成果 1981 2019

Cu-Cu Quasi-Direct Bonding with Atomically Thin-Au and Pt Intermediate Layer Using Atomic Layer Deposition

Kuwae, H., Yamada, K., Momose, W., Shoji, S. & Mizuno, J., 2019 4 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 207-211 5 p. 8733483. (2019 International Conference on Electronics Packaging, ICEP 2019).

研究成果: Conference contribution

Atomic layer deposition
Metalloids
Beer
Metals
Temperature
1 引用 (Scopus)

High-aspect-ratio Sub-2-μm vias using thermal imprint with build-up resin

Kamibayashi, T., Kuwae, H., Kishioka, T., Usui, Y., Ohashi, T., Tamura, M., Shoji, S. & Mizuno, J., 2019 1 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 115-118 4 p. 8625825. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 巻数 2018-October).

研究成果: Conference contribution

Aspect ratio
Resins
Thermosets
Fillers
Silica
1 引用 (Scopus)

Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition

Yamada, K., Kuwae, H., Kamibayashi, T., Momose, W., Shoji, S. & Mizuno, J., 2019 1 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 123-126 4 p. 8625756. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 巻数 2018-October).

研究成果: Conference contribution

Atomic layer deposition
Platinum
Copper
Temperature
Ultrathin films

Study of Low-residual Stress Amorphous Film Deposition Method for LiTaO3/Quartz or LiNbO3/Quartz Bonding toward 5G Surface Acoustic Wave Devices

Tezuka, A., Kuwae, H., Yamada, K., Shoji, S., Kakio, S. & Mizuno, J., 2019 4 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 414-417 4 p. 8733501. (2019 International Conference on Electronics Packaging, ICEP 2019).

研究成果: Conference contribution

Acoustic surface wave devices
Quartz
Amorphous films
Residual stresses
Substrates

Study on role of inserted Pt intermediate layer deposited by atomic layer deposition for Cu-Cu quasi-direct bonding

Yamada, K., Kuwae, H., Kamibayashi, T., Shoji, S., Momose, W. & Mizuno, J., 2019 5 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735244. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

研究成果: Conference contribution

Atomic layer deposition