横島 時彦

上級研究員(研究院教授)

  • 1756 引用
  • 24 h指数
19992019

年単位の研究成果

Pureに変更を加えた場合、すぐここに表示されます。

研究成果

フィルター
Conference contribution
2011

Microstructure of electrodeposited nano-crystalline Au-Ni alloy films

Inoue, T., Sato, K., Yokoshima, T., Sawaguchi, T., Sugiyama, A., Okinaka, Y. & Osaka, T., 2011 12 1, Molecular Structure of the Solid-Liquid Interface and Its Relationship to Electrodeposition 7. 37 版 p. 27-34 8 p. (ECS Transactions; 巻数 33, 番号 37).

研究成果: Conference contribution

2009

A method of "chemical flip-chip bonding" without loading and heating for ultra-fine chip-to-substrate interconnects

Yokoshima, T., Yamaji, Y., Kikuchi, K., Nakagawa, H. & Aoyagi, M., 2009 10 12, 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009. p. 80-86 7 p. 5074000. (Proceedings - Electronic Components and Technology Conference).

研究成果: Conference contribution

4 引用 (Scopus)

Maskless fabrication for micropad interconnection using electroless NiB deposition and application to "chemical" flip-chip bonding

Yokoshima, T., Yamaji, Y., Igawa, N., Kikuchi, K., Nakagawa, H. & Aoyagi, M., 2009 11 23, ECS Transactions - Electronics Packaging 3 - 214th ECS Meeting. 22 版 p. 77-85 9 p. (ECS Transactions; 巻数 16, 番号 22).

研究成果: Conference contribution

2 引用 (Scopus)
2008

A method of fabricating bump-less interconnects applicable to wafer-scale flip-chip bonding

Yamaji, Y., Yokoshima, T., Igawa, N., Kikuchi, K., Nakagawa, H. & Aoyagi, M., 2008 12 1, 10th Electronics Packaging Technology Conference, EPTC 2008. p. 657-662 6 p. 4763508. (10th Electronics Packaging Technology Conference, EPTC 2008).

研究成果: Conference contribution

4 引用 (Scopus)

Interconnection of multi-pad electrodes by "controlled anisotropic extraneous (CAEx) deposition" of electroless NiB film

Yokoshima, T., Yamaji, Y., Igawa, N., Tamura, Y., Kikuchi, K., Nakagawa, H. & Aoyagi, M., 2008 12 24, ECS Transactions - Electrodeposition of Nanoengineered Materials and Alloys 2. 28 版 p. 65-74 10 p. (ECS Transactions; 巻数 11, 番号 28).

研究成果: Conference contribution

3 引用 (Scopus)

Micro-cone-shaped Au-bump by gas deposition method for high-density interconnection of LSI chips

Imura, F., Nakagawa, H., Kikuchi, K., Yamaji, Y., Yokoshima, T., Aoyagi, M., Baba, S. & Akedo, J., 2008 12 1, 4th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2008, CICMT 2008. p. 269-271 3 p. (4th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2008, CICMT 2008).

研究成果: Conference contribution

2 引用 (Scopus)
2007

Novel flip-chip bonding technology using chemical process

Yamaji, Y., Yokoshima, T., Oosato, H., Igawa, N., Tamura, Y., Kikuchi, K., Nakagawa, H. & Aoyagi, M., 2007 10 22, Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07. p. 898-904 7 p. 4249991. (Proceedings - Electronic Components and Technology Conference).

研究成果: Conference contribution

8 引用 (Scopus)
2003

High BsCoFe thin films prepared by electrodeposition

Yokoshima, T., Imai, K., Shiga, D., Takashima, K. & Osaka, T., 2003, Intermag 2003 - Program of the 2003 IEEE International Magnetics Conference. Institute of Electrical and Electronics Engineers Inc., 1230340

研究成果: Conference contribution

2002

Increase on the resistivity of electrolessly deposited high Bs CoNiFeB thin films

Yokoshima, T., Sobue, M., Segawa, T., Osaka, T., Kaneko, D. & Tanaka, A., 2002, INTERMAG Europe 2002 - IEEE International Magnetics Conference. Institute of Electrical and Electronics Engineers Inc., 1000675

研究成果: Conference contribution