横島 時彦

上級研究員(研究院教授)

  • 1758 引用
  • 24 h指数
19992020

年単位の研究成果

Pureに変更を加えた場合、すぐここに表示されます。

研究成果

フィルター
Conference contribution
2002

Increase on the resistivity of electrolessly deposited high Bs CoNiFeB thin films

Yokoshima, T., Sobue, M., Segawa, T., Osaka, T., Kaneko, D. & Tanaka, A., 2002, INTERMAG Europe 2002 - IEEE International Magnetics Conference. Institute of Electrical and Electronics Engineers Inc., 1000675

研究成果: Conference contribution

2003

High BsCoFe thin films prepared by electrodeposition

Yokoshima, T., Imai, K., Shiga, D., Takashima, K. & Osaka, T., 2003, Intermag 2003 - Program of the 2003 IEEE International Magnetics Conference. Institute of Electrical and Electronics Engineers Inc., 1230340

研究成果: Conference contribution

2007

Novel flip-chip bonding technology using chemical process

Yamaji, Y., Yokoshima, T., Oosato, H., Igawa, N., Tamura, Y., Kikuchi, K., Nakagawa, H. & Aoyagi, M., 2007 10 22, Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07. p. 898-904 7 p. 4249991. (Proceedings - Electronic Components and Technology Conference).

研究成果: Conference contribution

8 引用 (Scopus)
2008

A method of fabricating bump-less interconnects applicable to wafer-scale flip-chip bonding

Yamaji, Y., Yokoshima, T., Igawa, N., Kikuchi, K., Nakagawa, H. & Aoyagi, M., 2008 12 1, 10th Electronics Packaging Technology Conference, EPTC 2008. p. 657-662 6 p. 4763508. (10th Electronics Packaging Technology Conference, EPTC 2008).

研究成果: Conference contribution

4 引用 (Scopus)

Interconnection of multi-pad electrodes by "controlled anisotropic extraneous (CAEx) deposition" of electroless NiB film

Yokoshima, T., Yamaji, Y., Igawa, N., Tamura, Y., Kikuchi, K., Nakagawa, H. & Aoyagi, M., 2008 12 24, ECS Transactions - Electrodeposition of Nanoengineered Materials and Alloys 2. 28 版 p. 65-74 10 p. (ECS Transactions; 巻数 11, 番号 28).

研究成果: Conference contribution

3 引用 (Scopus)

Micro-cone-shaped Au-bump by gas deposition method for high-density interconnection of LSI chips

Imura, F., Nakagawa, H., Kikuchi, K., Yamaji, Y., Yokoshima, T., Aoyagi, M., Baba, S. & Akedo, J., 2008 12 1, 4th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2008, CICMT 2008. p. 269-271 3 p. (4th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2008, CICMT 2008).

研究成果: Conference contribution

2 引用 (Scopus)
2009

A method of "chemical flip-chip bonding" without loading and heating for ultra-fine chip-to-substrate interconnects

Yokoshima, T., Yamaji, Y., Kikuchi, K., Nakagawa, H. & Aoyagi, M., 2009 10 12, 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009. p. 80-86 7 p. 5074000. (Proceedings - Electronic Components and Technology Conference).

研究成果: Conference contribution

4 引用 (Scopus)

Maskless fabrication for micropad interconnection using electroless NiB deposition and application to "chemical" flip-chip bonding

Yokoshima, T., Yamaji, Y., Igawa, N., Kikuchi, K., Nakagawa, H. & Aoyagi, M., 2009 11 23, ECS Transactions - Electronics Packaging 3 - 214th ECS Meeting. 22 版 p. 77-85 9 p. (ECS Transactions; 巻数 16, 番号 22).

研究成果: Conference contribution

2 引用 (Scopus)
2011

Microstructure of electrodeposited nano-crystalline Au-Ni alloy films

Inoue, T., Sato, K., Yokoshima, T., Sawaguchi, T., Sugiyama, A., Okinaka, Y. & Osaka, T., 2011 12 1, Molecular Structure of the Solid-Liquid Interface and Its Relationship to Electrodeposition 7. 37 版 p. 27-34 8 p. (ECS Transactions; 巻数 33, 番号 37).

研究成果: Conference contribution