年別の研究成果
年別の研究成果
フィンガープリント
Victor Parque Tenorioが活動している研究トピックを掘り下げます。このトピックラベルは、この研究者の研究成果に基づきます。これらがまとまってユニークなフィンガープリントを構成します。
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国/地域レベルにおける最近の外部共同研究。点をクリックして詳細を開くか、または
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A differential particle scheme and its application to PID parameter tuning of an inverted pendulum
Parque, V., 2021 7月 7, GECCO 2021 Companion - Proceedings of the 2021 Genetic and Evolutionary Computation Conference Companion. Association for Computing Machinery, Inc, p. 1937-1943 7 p. (GECCO 2021 Companion - Proceedings of the 2021 Genetic and Evolutionary Computation Conference Companion).研究成果: Conference contribution
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A Differential Particle Scheme with Successful Parent Selection and its Application to PID Control Tuning
Parque, V., 2021, 2021 IEEE Congress on Evolutionary Computation, CEC 2021 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 522-529 8 p. (2021 IEEE Congress on Evolutionary Computation, CEC 2021 - Proceedings).研究成果: Conference contribution
2 被引用数 (Scopus) -
An Efficient Scheme for the Generation of Ordered Trees in Constant Amortized Time
Parque, V. & Miyashita, T., 2021 1月 4, Proceedings of the 2021 15th International Conference on Ubiquitous Information Management and Communication, IMCOM 2021. Lee, S., Choo, H. & Ismail, R. (eds.). Institute of Electrical and Electronics Engineers Inc., 9377349. (Proceedings of the 2021 15th International Conference on Ubiquitous Information Management and Communication, IMCOM 2021).研究成果: Conference contribution
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A Study of Fairness Functionals for Smooth Path Planning in Mobile Robots
Parque, V., 2021 8月 23, 2021 IEEE 17th International Conference on Automation Science and Engineering, CASE 2021. IEEE Computer Society, p. 1568-1573 6 p. (IEEE International Conference on Automation Science and Engineering; vol. 2021-August).研究成果: Conference contribution
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Design optimization of copper patterns and location of power semiconductors and terminals
Abe, Y., Hirao, A., Kato, R., Ikeda, Y., Parque, V., Faiz, M. K., Yoshida, M. & Miyashita, T., 2021 5月 12, 2021 International Conference on Electronics Packaging, ICEP 2021. Institute of Electrical and Electronics Engineers Inc., p. 157-158 2 p. 9451973. (2021 International Conference on Electronics Packaging, ICEP 2021).研究成果: Conference contribution