年単位の研究成果
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- 2 同様のプロファイル
Experiments
Engineering & Materials Science
Finance
Engineering & Materials Science
3D printers
Engineering & Materials Science
Motion planning
Engineering & Materials Science
Economics
Engineering & Materials Science
Product design
Engineering & Materials Science
Computational Experiments
Mathematics
Differential Evolution
Mathematics
ネットワーク
最近の共同研究。丸をクリックして詳細を確認しましょう。
研究成果 2009 2019
1
引用
(Scopus)
Design factors for determining the radula shape of Euhadra Peliomphala
Miura, S., Saito, R., Parque Tenorio, V. & Miyashita, T., 2019 12 1, ： : Scientific Reports. 9, 1, 749.研究成果: Article
Biomimetics
Genetic Selection
Finite Element Analysis
Enhanced frequency analysis on a vibrated tumor with a compression cylinder
Miura, S., Ishiuchi, H., Shintaku, Y., Parque Tenorio, V., Torisaka, A. & Miyashita, T., 2019 12 1, ： : ROBOMECH Journal. 6, 1, 10.研究成果: Article
公開
Frequency Analysis
Tumors
Tumor
tumors
Compression
Heatsink design using spiral-fins considering additive manufacturing
Otake, S., Tateishi, Y., Gohara, H., Kato, R., Ikeda, Y., Parque Tenorio, V., Faiz, M. K., Yoshida, M. & Miyashita, T., 2019 4 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 46-51 6 p. 8733558. (2019 International Conference on Electronics Packaging, ICEP 2019).研究成果: Conference contribution
3D printers
Cooling
Heat resistance
Fins (heat exchange)
Heat generation
Path Bundling in Modular Bipartite Networks
Parque Tenorio, V., Miura, S. & Miyashita, T., 2019 1 1, Simulation and Modeling Methodologies, Technologies and Applications - 7th International Conference, SIMULTECH 2017, Revised Selected Papers. Ören, T., Rango, F. D. & Obaidat, M. S. (版). Springer-Verlag, p. 222-238 17 p. (Advances in Intelligent Systems and Computing; 巻数 873).研究成果: Conference contribution
Scalability
Geometry
Experiments
Spiral Folding of Thin Films with Curved Surface
Miura, S., Parque Tenorio, V., Ogawa, K. & Miyashita, T., 2019 1 16, Proceedings - 2018 IEEE International Conference on Systems, Man, and Cybernetics, SMC 2018. Institute of Electrical and Electronics Engineers Inc., p. 1699-1704 6 p. 8616290. (Proceedings - 2018 IEEE International Conference on Systems, Man, and Cybernetics, SMC 2018).研究成果: Conference contribution
Thin films
Therapeutic Uses
Adhesives
Plaster
Wounds and Injuries