2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults

Khanh N. Dang*, Michael Conrad Meyer, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan Tu Tran

*この研究の対応する著者

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

Through-Silicon-Via (TSV) is one of the most promising technologies to realize 3D Integrated Circuits (3D-ICs). However, the reliability issues due to the low yield rates, the sensitivity to thermal hotspots and stress issues due to the difference in temperature between layers are preventing TSV-based 3D-ICs from being widely and efficiently used. Due to defect clustering, 3D-ICs could have multiple defects in the same region which cannot be detected by using error correction codes while dedicated testing could take a significant number of testing cycles. This paper presents a 2D Parity Product Code (2D-PPC) with the ability to correct one fault and detect, at least, two faults. With the extension using Orthogonal Latin Square, 2D-PPC could detect multiple defects while reasonably increasing the area cost and latency.

本文言語English
ホスト出版物のタイトルProceedings - APCCAS 2019
ホスト出版物のサブタイトル2019 IEEE Asia Pacific Conference on Circuits and Systems: Innovative CAS Towards Sustainable Energy and Technology Disruption
出版社Institute of Electrical and Electronics Engineers Inc.
ページ109-112
ページ数4
ISBN(電子版)9781728129402
DOI
出版ステータスPublished - 2019 11
イベント15th Annual IEEE Asia Pacific Conference on Circuits and Systems, APCCAS 2019 - Bangkok, Thailand
継続期間: 2019 11 112019 11 14

出版物シリーズ

名前Proceedings - APCCAS 2019: 2019 IEEE Asia Pacific Conference on Circuits and Systems: Innovative CAS Towards Sustainable Energy and Technology Disruption

Conference

Conference15th Annual IEEE Asia Pacific Conference on Circuits and Systems, APCCAS 2019
国/地域Thailand
CityBangkok
Period19/11/1119/11/14

ASJC Scopus subject areas

  • エネルギー工学および電力技術
  • 再生可能エネルギー、持続可能性、環境
  • 電子工学および電気工学
  • 電子材料、光学材料、および磁性材料
  • 器械工学

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