抄録
A 300-GHz CMOS receiver module with a WR-3.4 waveguide interface is presented. The CMOS receiver is flip-chip mounted on a low-cost multilayered glass epoxy printed circuit board (PCB). A transmission-line-to-waveguide transition with a back-short structure is built into the PCB. The measured conversion gain, noise figure, and 3-dB bandwidth of the receiver module are approximately -23.7 dB, 33 dB and 18.4 GHz, respectively. Packaging loss is estimated to be approximately 4 dB from the conversion gain of the CMOS chip of -19.5 dB. A wireless data rate of 20 Gbit/s with 16-QAM was achieved using the designed modules.
| 元の言語 | English |
|---|---|
| ホスト出版物のタイトル | 2018 48th European Microwave Conference, EuMC 2018 |
| 出版者 | Institute of Electrical and Electronics Engineers Inc. |
| ページ | 396-399 |
| ページ数 | 4 |
| ISBN（電子版） | 9782874870514 |
| DOI | |
| 出版物ステータス | Published - 2018 11 20 |
| 外部発表 | Yes |
| イベント | 48th European Microwave Conference, EuMC 2018 - Madrid, Spain 継続期間: 2018 9 25 → 2018 9 27 |
Other
| Other | 48th European Microwave Conference, EuMC 2018 |
|---|---|
| 国 | Spain |
| 市 | Madrid |
| 期間 | 18/9/25 → 18/9/27 |
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ASJC Scopus subject areas
- Computer Networks and Communications
- Instrumentation
- Radiation
これを引用
300-GHz CMOS Receiver Module with WR-3.4 Waveguide Interface. / Hara, S.; Takano, K.; Katayama, Kosuke; Dong, R.; Mizuno, K.; Takahashi, K.; Watanabe, I.; Sekine, N.; Kasamatsu, A.; Yoshida, T.; Amakawa, S.; Fujishima, M.
2018 48th European Microwave Conference, EuMC 2018. Institute of Electrical and Electronics Engineers Inc., 2018. p. 396-399 8541693.研究成果: Conference contribution
}
TY - GEN
T1 - 300-GHz CMOS Receiver Module with WR-3.4 Waveguide Interface
AU - Hara, S.
AU - Takano, K.
AU - Katayama, Kosuke
AU - Dong, R.
AU - Mizuno, K.
AU - Takahashi, K.
AU - Watanabe, I.
AU - Sekine, N.
AU - Kasamatsu, A.
AU - Yoshida, T.
AU - Amakawa, S.
AU - Fujishima, M.
PY - 2018/11/20
Y1 - 2018/11/20
N2 - A 300-GHz CMOS receiver module with a WR-3.4 waveguide interface is presented. The CMOS receiver is flip-chip mounted on a low-cost multilayered glass epoxy printed circuit board (PCB). A transmission-line-to-waveguide transition with a back-short structure is built into the PCB. The measured conversion gain, noise figure, and 3-dB bandwidth of the receiver module are approximately -23.7 dB, 33 dB and 18.4 GHz, respectively. Packaging loss is estimated to be approximately 4 dB from the conversion gain of the CMOS chip of -19.5 dB. A wireless data rate of 20 Gbit/s with 16-QAM was achieved using the designed modules.
AB - A 300-GHz CMOS receiver module with a WR-3.4 waveguide interface is presented. The CMOS receiver is flip-chip mounted on a low-cost multilayered glass epoxy printed circuit board (PCB). A transmission-line-to-waveguide transition with a back-short structure is built into the PCB. The measured conversion gain, noise figure, and 3-dB bandwidth of the receiver module are approximately -23.7 dB, 33 dB and 18.4 GHz, respectively. Packaging loss is estimated to be approximately 4 dB from the conversion gain of the CMOS chip of -19.5 dB. A wireless data rate of 20 Gbit/s with 16-QAM was achieved using the designed modules.
KW - 300-GHz band
KW - CMOS
KW - receiver module
KW - terahertz wave
KW - waveguide transition
UR - http://www.scopus.com/inward/record.url?scp=85059807640&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85059807640&partnerID=8YFLogxK
U2 - 10.23919/EuMC.2018.8541693
DO - 10.23919/EuMC.2018.8541693
M3 - Conference contribution
SP - 396
EP - 399
BT - 2018 48th European Microwave Conference, EuMC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
ER -