300-GHz CMOS Receiver Module with WR-3.4 Waveguide Interface

S. Hara, K. Takano, Kosuke Katayama, R. Dong, K. Mizuno, K. Takahashi, I. Watanabe, N. Sekine, A. Kasamatsu, T. Yoshida, S. Amakawa, M. Fujishima

研究成果: Conference contribution

6 被引用数 (Scopus)

抄録

A 300-GHz CMOS receiver module with a WR-3.4 waveguide interface is presented. The CMOS receiver is flip-chip mounted on a low-cost multilayered glass epoxy printed circuit board (PCB). A transmission-line-to-waveguide transition with a back-short structure is built into the PCB. The measured conversion gain, noise figure, and 3-dB bandwidth of the receiver module are approximately -23.7 dB, 33 dB and 18.4 GHz, respectively. Packaging loss is estimated to be approximately 4 dB from the conversion gain of the CMOS chip of -19.5 dB. A wireless data rate of 20 Gbit/s with 16-QAM was achieved using the designed modules.

本文言語English
ホスト出版物のタイトル2018 48th European Microwave Conference, EuMC 2018
出版社Institute of Electrical and Electronics Engineers Inc.
ページ396-399
ページ数4
ISBN(電子版)9782874870514
DOI
出版ステータスPublished - 2018 11 20
外部発表はい
イベント48th European Microwave Conference, EuMC 2018 - Madrid, Spain
継続期間: 2018 9 252018 9 27

Other

Other48th European Microwave Conference, EuMC 2018
CountrySpain
CityMadrid
Period18/9/2518/9/27

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Instrumentation
  • Radiation

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