TY - GEN
T1 - 300-GHz CMOS Receiver Module with WR-3.4 Waveguide Interface
AU - Hara, S.
AU - Takano, K.
AU - Katayama, K.
AU - Dong, R.
AU - Mizuno, K.
AU - Takahashi, K.
AU - Watanabe, I.
AU - Sekine, N.
AU - Kasamatsu, A.
AU - Yoshida, T.
AU - Amakawa, S.
AU - Fujishima, M.
N1 - Funding Information:
ACKNOWLEDGMENT This work was supported by R&D on wireless transceiver systems with CMOS technology in 300GHz band, as part of an R&D program for key technology in terahertz frequency bands by the Ministry of Internal Affair and Communications of Japan.
Publisher Copyright:
© 2018 European Microwave Association.
PY - 2018/11/20
Y1 - 2018/11/20
N2 - A 300-GHz CMOS receiver module with a WR-3.4 waveguide interface is presented. The CMOS receiver is flip-chip mounted on a low-cost multilayered glass epoxy printed circuit board (PCB). A transmission-line-to-waveguide transition with a back-short structure is built into the PCB. The measured conversion gain, noise figure, and 3-dB bandwidth of the receiver module are approximately -23.7 dB, 33 dB and 18.4 GHz, respectively. Packaging loss is estimated to be approximately 4 dB from the conversion gain of the CMOS chip of -19.5 dB. A wireless data rate of 20 Gbit/s with 16-QAM was achieved using the designed modules.
AB - A 300-GHz CMOS receiver module with a WR-3.4 waveguide interface is presented. The CMOS receiver is flip-chip mounted on a low-cost multilayered glass epoxy printed circuit board (PCB). A transmission-line-to-waveguide transition with a back-short structure is built into the PCB. The measured conversion gain, noise figure, and 3-dB bandwidth of the receiver module are approximately -23.7 dB, 33 dB and 18.4 GHz, respectively. Packaging loss is estimated to be approximately 4 dB from the conversion gain of the CMOS chip of -19.5 dB. A wireless data rate of 20 Gbit/s with 16-QAM was achieved using the designed modules.
KW - 300-GHz band
KW - CMOS
KW - receiver module
KW - terahertz wave
KW - waveguide transition
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U2 - 10.23919/EuMC.2018.8541693
DO - 10.23919/EuMC.2018.8541693
M3 - Conference contribution
AN - SCOPUS:85059807640
T3 - 2018 48th European Microwave Conference, EuMC 2018
SP - 396
EP - 399
BT - 2018 48th European Microwave Conference, EuMC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 48th European Microwave Conference, EuMC 2018
Y2 - 25 September 2018 through 27 September 2018
ER -