300-GHz CMOS Receiver Module with WR-3.4 Waveguide Interface

S. Hara, K. Takano, Kosuke Katayama, R. Dong, K. Mizuno, K. Takahashi, I. Watanabe, N. Sekine, A. Kasamatsu, T. Yoshida, S. Amakawa, M. Fujishima

研究成果: Conference contribution

1 引用 (Scopus)

抄録

A 300-GHz CMOS receiver module with a WR-3.4 waveguide interface is presented. The CMOS receiver is flip-chip mounted on a low-cost multilayered glass epoxy printed circuit board (PCB). A transmission-line-to-waveguide transition with a back-short structure is built into the PCB. The measured conversion gain, noise figure, and 3-dB bandwidth of the receiver module are approximately -23.7 dB, 33 dB and 18.4 GHz, respectively. Packaging loss is estimated to be approximately 4 dB from the conversion gain of the CMOS chip of -19.5 dB. A wireless data rate of 20 Gbit/s with 16-QAM was achieved using the designed modules.

元の言語English
ホスト出版物のタイトル2018 48th European Microwave Conference, EuMC 2018
出版者Institute of Electrical and Electronics Engineers Inc.
ページ396-399
ページ数4
ISBN(電子版)9782874870514
DOI
出版物ステータスPublished - 2018 11 20
外部発表Yes
イベント48th European Microwave Conference, EuMC 2018 - Madrid, Spain
継続期間: 2018 9 252018 9 27

Other

Other48th European Microwave Conference, EuMC 2018
Spain
Madrid
期間18/9/2518/9/27

Fingerprint

Printed circuit boards
CMOS
Waveguides
receivers
modules
printed circuits
circuit boards
waveguides
Quadrature amplitude modulation
Noise figure
chips
Electric lines
Packaging
quadrature amplitude modulation
Bandwidth
packaging
Glass
transmission lines
bandwidth
Costs

Keywords

    ASJC Scopus subject areas

    • Computer Networks and Communications
    • Instrumentation
    • Radiation

    これを引用

    Hara, S., Takano, K., Katayama, K., Dong, R., Mizuno, K., Takahashi, K., ... Fujishima, M. (2018). 300-GHz CMOS Receiver Module with WR-3.4 Waveguide Interface. : 2018 48th European Microwave Conference, EuMC 2018 (pp. 396-399). [8541693] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/EuMC.2018.8541693

    300-GHz CMOS Receiver Module with WR-3.4 Waveguide Interface. / Hara, S.; Takano, K.; Katayama, Kosuke; Dong, R.; Mizuno, K.; Takahashi, K.; Watanabe, I.; Sekine, N.; Kasamatsu, A.; Yoshida, T.; Amakawa, S.; Fujishima, M.

    2018 48th European Microwave Conference, EuMC 2018. Institute of Electrical and Electronics Engineers Inc., 2018. p. 396-399 8541693.

    研究成果: Conference contribution

    Hara, S, Takano, K, Katayama, K, Dong, R, Mizuno, K, Takahashi, K, Watanabe, I, Sekine, N, Kasamatsu, A, Yoshida, T, Amakawa, S & Fujishima, M 2018, 300-GHz CMOS Receiver Module with WR-3.4 Waveguide Interface. : 2018 48th European Microwave Conference, EuMC 2018., 8541693, Institute of Electrical and Electronics Engineers Inc., pp. 396-399, 48th European Microwave Conference, EuMC 2018, Madrid, Spain, 18/9/25. https://doi.org/10.23919/EuMC.2018.8541693
    Hara S, Takano K, Katayama K, Dong R, Mizuno K, Takahashi K その他. 300-GHz CMOS Receiver Module with WR-3.4 Waveguide Interface. : 2018 48th European Microwave Conference, EuMC 2018. Institute of Electrical and Electronics Engineers Inc. 2018. p. 396-399. 8541693 https://doi.org/10.23919/EuMC.2018.8541693
    Hara, S. ; Takano, K. ; Katayama, Kosuke ; Dong, R. ; Mizuno, K. ; Takahashi, K. ; Watanabe, I. ; Sekine, N. ; Kasamatsu, A. ; Yoshida, T. ; Amakawa, S. ; Fujishima, M. / 300-GHz CMOS Receiver Module with WR-3.4 Waveguide Interface. 2018 48th European Microwave Conference, EuMC 2018. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 396-399
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    abstract = "A 300-GHz CMOS receiver module with a WR-3.4 waveguide interface is presented. The CMOS receiver is flip-chip mounted on a low-cost multilayered glass epoxy printed circuit board (PCB). A transmission-line-to-waveguide transition with a back-short structure is built into the PCB. The measured conversion gain, noise figure, and 3-dB bandwidth of the receiver module are approximately -23.7 dB, 33 dB and 18.4 GHz, respectively. Packaging loss is estimated to be approximately 4 dB from the conversion gain of the CMOS chip of -19.5 dB. A wireless data rate of 20 Gbit/s with 16-QAM was achieved using the designed modules.",
    keywords = "300-GHz band, CMOS, receiver module, terahertz wave, waveguide transition",
    author = "S. Hara and K. Takano and Kosuke Katayama and R. Dong and K. Mizuno and K. Takahashi and I. Watanabe and N. Sekine and A. Kasamatsu and T. Yoshida and S. Amakawa and M. Fujishima",
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    AU - Takano, K.

    AU - Katayama, Kosuke

    AU - Dong, R.

    AU - Mizuno, K.

    AU - Takahashi, K.

    AU - Watanabe, I.

    AU - Sekine, N.

    AU - Kasamatsu, A.

    AU - Yoshida, T.

    AU - Amakawa, S.

    AU - Fujishima, M.

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    AB - A 300-GHz CMOS receiver module with a WR-3.4 waveguide interface is presented. The CMOS receiver is flip-chip mounted on a low-cost multilayered glass epoxy printed circuit board (PCB). A transmission-line-to-waveguide transition with a back-short structure is built into the PCB. The measured conversion gain, noise figure, and 3-dB bandwidth of the receiver module are approximately -23.7 dB, 33 dB and 18.4 GHz, respectively. Packaging loss is estimated to be approximately 4 dB from the conversion gain of the CMOS chip of -19.5 dB. A wireless data rate of 20 Gbit/s with 16-QAM was achieved using the designed modules.

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    KW - receiver module

    KW - terahertz wave

    KW - waveguide transition

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