300-GHz CMOS transmitter module with built-in waveguide transition on a multilayered glass epoxy PCB

K. Takano; Kosuke Katayama; S. Hara; R. Dong; K. Mizuno; K. Takahashi; A. Kasamatsu; T. Yoshida; S. Amakawa; M. Fujishima

doi:10.1109/RWS.2018.8304972

300-GHz CMOS transmitter module with built-in waveguide transition on a multilayered glass epoxy PCB

K. Takano, Kosuke Katayama, S. Hara, R. Dong, K. Mizuno, K. Takahashi, A. Kasamatsu, T. Yoshida, S. Amakawa, M. Fujishima

研究成果: Conference contribution

13 被引用数 (Scopus)

抄録

A 300-GHz CMOS transmitter module with a WR-3.4 waveguide interface is presented. The CMOS transmitter is flip-chip mounted on a low-cost multilayered glass epoxy printed circuit board (PCB) and a transmission-line-to-waveguide transition with a back-short structure is built of the multilayered PCB. The measured output power and 3-dB bandwidth of the transmitter module are approximately -13.5 dBm and 10 GHz, respectively. A wireless data rate of 48 Gbit/s over 5 cm with 16-QAM is achieved using the module.

本文言語	English
ホスト出版物のタイトル	RWS 2018 - Proceedings
ホスト出版物のサブタイトル	2018 IEEE Radio and Wireless Symposium
出版社	IEEE Computer Society
ページ	154-156
ページ数	3
巻	2018-January
ISBN（電子版）	9781538607091
DOI	https://doi.org/10.1109/RWS.2018.8304972
出版ステータス	Published - 2018 2 28
外部発表	はい
イベント	2018 IEEE Radio and Wireless Symposium, RWS 2018 - Anaheim, United States 継続期間: 2018 1 14 → 2018 1 17

Other

Other	2018 IEEE Radio and Wireless Symposium, RWS 2018
Country	United States
City	Anaheim
Period	18/1/14 → 18/1/17

ASJC Scopus subject areas

Computer Networks and Communications
Computer Science Applications
Electrical and Electronic Engineering
Communication

文献へのアクセス

10.1109/RWS.2018.8304972

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引用スタイル

Takano, K., Katayama, K., Hara, S., Dong, R., Mizuno, K., Takahashi, K., Kasamatsu, A., Yoshida, T., Amakawa, S., & Fujishima, M. (2018). 300-GHz CMOS transmitter module with built-in waveguide transition on a multilayered glass epoxy PCB. In RWS 2018 - Proceedings: 2018 IEEE Radio and Wireless Symposium (Vol. 2018-January, pp. 154-156). IEEE Computer Society. https://doi.org/10.1109/RWS.2018.8304972

300-GHz CMOS transmitter module with built-in waveguide transition on a multilayered glass epoxy PCB. / Takano, K.; Katayama, Kosuke; Hara, S.; Dong, R.; Mizuno, K.; Takahashi, K.; Kasamatsu, A.; Yoshida, T.; Amakawa, S.; Fujishima, M.

RWS 2018 - Proceedings: 2018 IEEE Radio and Wireless Symposium. Vol. 2018-January IEEE Computer Society, 2018. p. 154-156.

研究成果: Conference contribution

Takano, K, Katayama, K, Hara, S, Dong, R, Mizuno, K, Takahashi, K, Kasamatsu, A, Yoshida, T, Amakawa, S & Fujishima, M 2018, 300-GHz CMOS transmitter module with built-in waveguide transition on a multilayered glass epoxy PCB. in RWS 2018 - Proceedings: 2018 IEEE Radio and Wireless Symposium. vol. 2018-January, IEEE Computer Society, pp. 154-156, 2018 IEEE Radio and Wireless Symposium, RWS 2018, Anaheim, United States, 18/1/14. https://doi.org/10.1109/RWS.2018.8304972

@inproceedings{042990acac4a4982ad92b4066079af0f,

title = "300-GHz CMOS transmitter module with built-in waveguide transition on a multilayered glass epoxy PCB",

abstract = "A 300-GHz CMOS transmitter module with a WR-3.4 waveguide interface is presented. The CMOS transmitter is flip-chip mounted on a low-cost multilayered glass epoxy printed circuit board (PCB) and a transmission-line-to-waveguide transition with a back-short structure is built of the multilayered PCB. The measured output power and 3-dB bandwidth of the transmitter module are approximately -13.5 dBm and 10 GHz, respectively. A wireless data rate of 48 Gbit/s over 5 cm with 16-QAM is achieved using the module.",

keywords = "300-GHz band, CMOS, Terahertz wave, Transmitter module, Waveguide transition, Wireless link",

author = "K. Takano and Kosuke Katayama and S. Hara and R. Dong and K. Mizuno and K. Takahashi and A. Kasamatsu and T. Yoshida and S. Amakawa and M. Fujishima",

year = "2018",

month = feb,

day = "28",

doi = "10.1109/RWS.2018.8304972",

language = "English",

volume = "2018-January",

pages = "154--156",

booktitle = "RWS 2018 - Proceedings",

publisher = "IEEE Computer Society",

note = "2018 IEEE Radio and Wireless Symposium, RWS 2018 ; Conference date: 14-01-2018 Through 17-01-2018",

}

TY - GEN

T1 - 300-GHz CMOS transmitter module with built-in waveguide transition on a multilayered glass epoxy PCB

AU - Takano, K.

AU - Katayama, Kosuke

AU - Hara, S.

AU - Dong, R.

AU - Mizuno, K.

AU - Takahashi, K.

AU - Kasamatsu, A.

AU - Yoshida, T.

AU - Amakawa, S.

AU - Fujishima, M.

PY - 2018/2/28

Y1 - 2018/2/28

N2 - A 300-GHz CMOS transmitter module with a WR-3.4 waveguide interface is presented. The CMOS transmitter is flip-chip mounted on a low-cost multilayered glass epoxy printed circuit board (PCB) and a transmission-line-to-waveguide transition with a back-short structure is built of the multilayered PCB. The measured output power and 3-dB bandwidth of the transmitter module are approximately -13.5 dBm and 10 GHz, respectively. A wireless data rate of 48 Gbit/s over 5 cm with 16-QAM is achieved using the module.

AB - A 300-GHz CMOS transmitter module with a WR-3.4 waveguide interface is presented. The CMOS transmitter is flip-chip mounted on a low-cost multilayered glass epoxy printed circuit board (PCB) and a transmission-line-to-waveguide transition with a back-short structure is built of the multilayered PCB. The measured output power and 3-dB bandwidth of the transmitter module are approximately -13.5 dBm and 10 GHz, respectively. A wireless data rate of 48 Gbit/s over 5 cm with 16-QAM is achieved using the module.

KW - 300-GHz band

KW - CMOS

KW - Terahertz wave

KW - Transmitter module

KW - Waveguide transition

KW - Wireless link

UR - http://www.scopus.com/inward/record.url?scp=85045550641&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85045550641&partnerID=8YFLogxK

U2 - 10.1109/RWS.2018.8304972

DO - 10.1109/RWS.2018.8304972

M3 - Conference contribution

AN - SCOPUS:85045550641

VL - 2018-January

SP - 154

EP - 156

BT - RWS 2018 - Proceedings

PB - IEEE Computer Society

T2 - 2018 IEEE Radio and Wireless Symposium, RWS 2018

Y2 - 14 January 2018 through 17 January 2018

ER -