@inproceedings{042990acac4a4982ad92b4066079af0f,
title = "300-GHz CMOS transmitter module with built-in waveguide transition on a multilayered glass epoxy PCB",
abstract = "A 300-GHz CMOS transmitter module with a WR-3.4 waveguide interface is presented. The CMOS transmitter is flip-chip mounted on a low-cost multilayered glass epoxy printed circuit board (PCB) and a transmission-line-to-waveguide transition with a back-short structure is built of the multilayered PCB. The measured output power and 3-dB bandwidth of the transmitter module are approximately -13.5 dBm and 10 GHz, respectively. A wireless data rate of 48 Gbit/s over 5 cm with 16-QAM is achieved using the module.",
keywords = "300-GHz band, CMOS, Terahertz wave, Transmitter module, Waveguide transition, Wireless link",
author = "K. Takano and K. Katayama and S. Hara and R. Dong and K. Mizuno and K. Takahashi and A. Kasamatsu and T. Yoshida and S. Amakawa and M. Fujishima",
note = "Funding Information: This work was supported by the Ministry of Internal Publisher Copyright: {\textcopyright} 2018 IEEE.; 2018 IEEE Radio and Wireless Symposium, RWS 2018 ; Conference date: 14-01-2018 Through 17-01-2018",
year = "2018",
month = feb,
day = "28",
doi = "10.1109/RWS.2018.8304972",
language = "English",
series = "IEEE Radio and Wireless Symposium, RWS",
publisher = "IEEE Computer Society",
pages = "154--156",
booktitle = "RWS 2018 - Proceedings",
}