300-GHz CMOS transmitter module with built-in waveguide transition on a multilayered glass epoxy PCB

K. Takano, Kosuke Katayama, S. Hara, R. Dong, K. Mizuno, K. Takahashi, A. Kasamatsu, T. Yoshida, S. Amakawa, M. Fujishima

研究成果: Conference contribution

13 被引用数 (Scopus)

抄録

A 300-GHz CMOS transmitter module with a WR-3.4 waveguide interface is presented. The CMOS transmitter is flip-chip mounted on a low-cost multilayered glass epoxy printed circuit board (PCB) and a transmission-line-to-waveguide transition with a back-short structure is built of the multilayered PCB. The measured output power and 3-dB bandwidth of the transmitter module are approximately -13.5 dBm and 10 GHz, respectively. A wireless data rate of 48 Gbit/s over 5 cm with 16-QAM is achieved using the module.

本文言語English
ホスト出版物のタイトルRWS 2018 - Proceedings
ホスト出版物のサブタイトル2018 IEEE Radio and Wireless Symposium
出版社IEEE Computer Society
ページ154-156
ページ数3
2018-January
ISBN(電子版)9781538607091
DOI
出版ステータスPublished - 2018 2 28
外部発表はい
イベント2018 IEEE Radio and Wireless Symposium, RWS 2018 - Anaheim, United States
継続期間: 2018 1 142018 1 17

Other

Other2018 IEEE Radio and Wireless Symposium, RWS 2018
CountryUnited States
CityAnaheim
Period18/1/1418/1/17

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Computer Science Applications
  • Electrical and Electronic Engineering
  • Communication

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