抄録
A 300-GHz CMOS transmitter module with a WR-3.4 waveguide interface is presented. The CMOS transmitter is flip-chip mounted on a low-cost multilayered glass epoxy printed circuit board (PCB) and a transmission-line-to-waveguide transition with a back-short structure is built of the multilayered PCB. The measured output power and 3-dB bandwidth of the transmitter module are approximately -13.5 dBm and 10 GHz, respectively. A wireless data rate of 48 Gbit/s over 5 cm with 16-QAM is achieved using the module.
| 元の言語 | English |
|---|---|
| ホスト出版物のタイトル | RWS 2018 - Proceedings |
| ホスト出版物のサブタイトル | 2018 IEEE Radio and Wireless Symposium |
| 出版者 | IEEE Computer Society |
| ページ | 154-156 |
| ページ数 | 3 |
| 巻 | 2018-January |
| ISBN（電子版） | 9781538607091 |
| DOI | |
| 出版物ステータス | Published - 2018 2 28 |
| 外部発表 | Yes |
| イベント | 2018 IEEE Radio and Wireless Symposium, RWS 2018 - Anaheim, United States 継続期間: 2018 1 14 → 2018 1 17 |
Other
| Other | 2018 IEEE Radio and Wireless Symposium, RWS 2018 |
|---|---|
| 国 | United States |
| 市 | Anaheim |
| 期間 | 18/1/14 → 18/1/17 |
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ASJC Scopus subject areas
- Computer Networks and Communications
- Computer Science Applications
- Electrical and Electronic Engineering
- Communication
これを引用
300-GHz CMOS transmitter module with built-in waveguide transition on a multilayered glass epoxy PCB. / Takano, K.; Katayama, Kosuke; Hara, S.; Dong, R.; Mizuno, K.; Takahashi, K.; Kasamatsu, A.; Yoshida, T.; Amakawa, S.; Fujishima, M.
RWS 2018 - Proceedings: 2018 IEEE Radio and Wireless Symposium. 巻 2018-January IEEE Computer Society, 2018. p. 154-156.研究成果: Conference contribution
}
TY - GEN
T1 - 300-GHz CMOS transmitter module with built-in waveguide transition on a multilayered glass epoxy PCB
AU - Takano, K.
AU - Katayama, Kosuke
AU - Hara, S.
AU - Dong, R.
AU - Mizuno, K.
AU - Takahashi, K.
AU - Kasamatsu, A.
AU - Yoshida, T.
AU - Amakawa, S.
AU - Fujishima, M.
PY - 2018/2/28
Y1 - 2018/2/28
N2 - A 300-GHz CMOS transmitter module with a WR-3.4 waveguide interface is presented. The CMOS transmitter is flip-chip mounted on a low-cost multilayered glass epoxy printed circuit board (PCB) and a transmission-line-to-waveguide transition with a back-short structure is built of the multilayered PCB. The measured output power and 3-dB bandwidth of the transmitter module are approximately -13.5 dBm and 10 GHz, respectively. A wireless data rate of 48 Gbit/s over 5 cm with 16-QAM is achieved using the module.
AB - A 300-GHz CMOS transmitter module with a WR-3.4 waveguide interface is presented. The CMOS transmitter is flip-chip mounted on a low-cost multilayered glass epoxy printed circuit board (PCB) and a transmission-line-to-waveguide transition with a back-short structure is built of the multilayered PCB. The measured output power and 3-dB bandwidth of the transmitter module are approximately -13.5 dBm and 10 GHz, respectively. A wireless data rate of 48 Gbit/s over 5 cm with 16-QAM is achieved using the module.
KW - 300-GHz band
KW - CMOS
KW - Terahertz wave
KW - Transmitter module
KW - Waveguide transition
KW - Wireless link
UR - http://www.scopus.com/inward/record.url?scp=85045550641&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85045550641&partnerID=8YFLogxK
U2 - 10.1109/RWS.2018.8304972
DO - 10.1109/RWS.2018.8304972
M3 - Conference contribution
VL - 2018-January
SP - 154
EP - 156
BT - RWS 2018 - Proceedings
PB - IEEE Computer Society
ER -