3.5W HBT MMIC power amplifier module for mobile communications

Keiichi Sakuno, Masanori Akagi, Hiroya Sato, Masato Miyauchi, Masatomo Hasegawa, Toshihiko Yoshimasu, Shinji Hara

研究成果: Conference contribution

15 引用 (Scopus)

抜粋

A 900MHz-band GaAs/GaAlAs HBT MMIC power amplifier module has been developed for mobile communications by using a novel assembly technique called BHS and an AIN package as the MMIC chip carrier. The power module gave a peak output power of 3.7W and a power-added efficiency of 54.5% with a +6V single supply voltage.

元の言語English
ホスト出版物のタイトルDigest of Papers - IEEE Microwave and Millimeter-Wave Monolithic Circuits Symposium
出版場所Piscataway, NJ, United States
出版者Publ by IEEE
ページ63-66
ページ数4
ISBN(印刷物)0780314190
出版物ステータスPublished - 1994
外部発表Yes
イベントProceedings of the IEEE 1994 Microwave and Millimeter-Wave Monolithic Circuits Symposium - San Diego, CA, USA
継続期間: 1994 5 231994 5 25

Other

OtherProceedings of the IEEE 1994 Microwave and Millimeter-Wave Monolithic Circuits Symposium
San Diego, CA, USA
期間94/5/2394/5/25

    フィンガープリント

ASJC Scopus subject areas

  • Engineering(all)

これを引用

Sakuno, K., Akagi, M., Sato, H., Miyauchi, M., Hasegawa, M., Yoshimasu, T., & Hara, S. (1994). 3.5W HBT MMIC power amplifier module for mobile communications. : Digest of Papers - IEEE Microwave and Millimeter-Wave Monolithic Circuits Symposium (pp. 63-66). Publ by IEEE.