3.5W HBT MMIC power amplifier module for mobile communications

Keiichi Sakuno, Masanori Akagi, Hiroya Sato, Masato Miyauchi, Masatomo Hasegawa, Toshihiko Yoshimasu, Shinji Hara

研究成果: Conference contribution

15 被引用数 (Scopus)

抄録

A 900MHz-band GaAs/GaAlAs HBT MMIC power amplifier module has been developed for mobile communications by using a novel assembly technique called BHS and an AIN package as the MMIC chip carrier. The power module gave a peak output power of 3.7W and a power-added efficiency of 54.5% with a +6V single supply voltage.

本文言語English
ホスト出版物のタイトルDigest of Papers - IEEE Microwave and Millimeter-Wave Monolithic Circuits Symposium
出版社Publ by IEEE
ページ63-66
ページ数4
ISBN(印刷版)0780314190
出版ステータスPublished - 1994 1 1
外部発表はい
イベントProceedings of the IEEE 1994 Microwave and Millimeter-Wave Monolithic Circuits Symposium - San Diego, CA, USA
継続期間: 1994 5 231994 5 25

出版物シリーズ

名前Digest of Papers - IEEE Microwave and Millimeter-Wave Monolithic Circuits Symposium
ISSN(印刷版)0074-8587

Other

OtherProceedings of the IEEE 1994 Microwave and Millimeter-Wave Monolithic Circuits Symposium
CitySan Diego, CA, USA
Period94/5/2394/5/25

ASJC Scopus subject areas

  • Engineering(all)

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