3D-IC signal TSV assignment for thermal and wirelength optimization

Yuxin Qian, Cong Hao, Takeshi Yoshimura

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

In 3D integrated circuit (3D-IC), there are two or more layers of active electronic components which are integrated both vertically and horizontally. Through-silicon-via (TSV) is used as the vertical electrical connection which enables a great deal of functionality packed into a small footprint. In this work we solve the signal TSV assignment problem in 3D-IC taking thermal problem into consideration, while only wire length is concerned in the previous work. Firstly, we propose a multilevel node-weight-oriented flow assignment algorithm to reduce wire length and temperature simultaneously. During the evaluation of wire length and temperature result, we use a thermal estimation model to evaluate temperature, where compression storage method with LU decomposition is adopted to improve algorithm efficiency. Moreover, we implement the remove and reassign optimization method which helps further optimize the TSV assignment results. The experimental results show that our algorithm provides better solution with wire length reduction and temperature decrease.

本文言語English
ホスト出版物のタイトル2017 27th International Symposium on Power and Timing Modeling, Optimization and Simulation, PATMOS 2017
出版社Institute of Electrical and Electronics Engineers Inc.
ページ1-8
ページ数8
2017-January
ISBN(電子版)9781509064625
DOI
出版ステータスPublished - 2017 11 13
イベント27th International Symposium on Power and Timing Modeling, Optimization and Simulation, PATMOS 2017 - Thessaloniki, Greece
継続期間: 2017 9 252017 9 27

Other

Other27th International Symposium on Power and Timing Modeling, Optimization and Simulation, PATMOS 2017
CountryGreece
CityThessaloniki
Period17/9/2517/9/27

ASJC Scopus subject areas

  • Modelling and Simulation
  • Computer Networks and Communications
  • Hardware and Architecture
  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering
  • Control and Optimization

フィンガープリント 「3D-IC signal TSV assignment for thermal and wirelength optimization」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル