3D integration of heterogeneous MEMS structures by stamping transfer

Hiroaki Onoe, Eiji Iwase, Kiyoshi Matsumoto, Isao Shimoyama

研究成果: Conference contribution

8 引用 (Scopus)

抜粋

We propose an integration method of heterogeneous micro-electro-mechanical- system (MEMS) structures by liftoff and stamping transfer using a poly-(dimethylsiloxane) (PDMS) sheet. Silicon structures fabricated on multiple wafers were lifted off by PDMS sheets, and integrated onto a single wafer by the stamping transfer with high yield (>90 %) and high accuracy (position error <500 nm). A two-dimensional (2D) integration and three-dimensional (3D) assembly of pyramid-like/inverted pyramid-like structures were demonstrated by our method. These demonstrations prove that our method enables us to integrate process-incompatible heterogeneous MEMS structures onto a single wafer.

元の言語English
ホスト出版物のタイトルProceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007
ページ175-178
ページ数4
出版物ステータスPublished - 2007 12 1
外部発表Yes
イベント20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007 - Kobe, Japan
継続期間: 2007 1 212007 1 25

出版物シリーズ

名前Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN(印刷物)1084-6999

Conference

Conference20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007
Japan
Kobe
期間07/1/2107/1/25

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • これを引用

    Onoe, H., Iwase, E., Matsumoto, K., & Shimoyama, I. (2007). 3D integration of heterogeneous MEMS structures by stamping transfer. : Proceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007 (pp. 175-178). [4433045] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).