56-Gbaud 4-PAM (112-Gbit/s) operation of flip-chip interconnection lumped-electrode EADFB laser module for equalizer-free transmission

Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Yasuhiko Nakanishi, Hiroshi Yamazaki, Yuta Ueda, Wataru Kobayashi, Yoshifumi Muramoto, Hiroyuki Ishii, Hiroaki Sanjoh

研究成果: Conference contribution

8 引用 (Scopus)

抜粋

We fabricated a lumped-electrode type EADFB laser module using a flip-chip interconnection technique which provides a large modulation bandwidth. We obtained clear 56-Gbaud 4-PAM signal after 10-km SMF transmission with no equalizer using this module.

元の言語English
ホスト出版物のタイトル2016 Optical Fiber Communications Conference and Exhibition, OFC 2016
出版者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子版)9781943580071
出版物ステータスPublished - 2016 8 9
外部発表Yes
イベント2016 Optical Fiber Communications Conference and Exhibition, OFC 2016 - Anaheim, United States
継続期間: 2016 3 202016 3 24

Other

Other2016 Optical Fiber Communications Conference and Exhibition, OFC 2016
United States
Anaheim
期間16/3/2016/3/24

    フィンガープリント

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Signal Processing
  • Atomic and Molecular Physics, and Optics

これを引用

Kanazawa, S., Fujisawa, T., Takahata, K., Nakanishi, Y., Yamazaki, H., Ueda, Y., Kobayashi, W., Muramoto, Y., Ishii, H., & Sanjoh, H. (2016). 56-Gbaud 4-PAM (112-Gbit/s) operation of flip-chip interconnection lumped-electrode EADFB laser module for equalizer-free transmission. : 2016 Optical Fiber Communications Conference and Exhibition, OFC 2016 [7537846] Institute of Electrical and Electronics Engineers Inc..