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Conference contribution
Low-latency fiber-millimeter-wave system for future mobile fronthauling
Tien Dat, P., Kanno, A., Yamamoto, N. & Kawanishi, T., 2016, Broadband Access Communication Technologies X. SPIE, Vol. 9772. 97720D研究成果: Conference contribution
3 被引用数 (Scopus) -
Low-latency fiber-wireless bridge for flexible fronthauling in future mobile networks
Dat, P. T., Kanno, A. & Kawanishi, T., 2015 12月 2, European Microwave Week 2015:. Institute of Electrical and Electronics Engineers Inc., p. 305-308 4 p. 7345130研究成果: Conference contribution
1 被引用数 (Scopus) -
Low-latency fiber-wireless bridge for flexible fronthauling in future mobile networks
Dat, P. T., Kanno, A. & Kawanishi, T., 2015 12月 2, European Microwave Week 2015: "Freedom Through Microwaves", EuMW 2015 - Conference Proceedings; 2015 45th European Microwave Conference Proceedings, EuMC. Institute of Electrical and Electronics Engineers Inc., p. 1156-1159 4 p. 7345973. (European Microwave Week 2015: "Freedom Through Microwaves", EuMW 2015 - Conference Proceedings; 2015 45th European Microwave Conference Proceedings, EuMC).研究成果: Conference contribution
3 被引用数 (Scopus) -
Low-latency meeting recognition and understanding using distant microphones
Araki, S., Hori, T., Yoshioka, T., Fujimoto, M., Watanabe, S., Oba, T., Ogawa, A., Otsuka, K., Mikami, D., Delcroix, M., Kinoshita, K., Nakatani, T., Nakamura, A. & Yamato, J., 2011, 2011 Joint Workshop on Hands-free Speech Communication and Microphone Arrays, HSCMA'11. p. 151-152 2 p. 5942383. (2011 Joint Workshop on Hands-free Speech Communication and Microphone Arrays, HSCMA'11).研究成果: Conference contribution
3 被引用数 (Scopus) -
Low Latency Online Source Separation and Noise Reduction Based on Joint Optimization with Dereverberation
Ueda, T., Nakatani, T., Ikeshita, R., Kinoshita, K., Araki, S. & Makino, S., 2021, 29th European Signal Processing Conference, EUSIPCO 2021 - Proceedings. European Signal Processing Conference, EUSIPCO, p. 1000-1004 5 p. (European Signal Processing Conference; vol. 2021-August).研究成果: Conference contribution
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Low-loss and low-crosstalk all-fiber-based six-mode multiplexer and demultiplexer for mode-multiplexed QAM signals in C-band
Igarashi, K., Wakayama, Y., Soma, D., Tsuritani, T., Morita, I., Park, K. J., Ko, J. & Kim, B. Y., 2018, Optical Fiber Communication Conference, OFC 2018. OSA - The Optical Society, (Optics InfoBase Conference Papers; vol. Part F84-OFC 2018).研究成果: Conference contribution
2 被引用数 (Scopus) -
Low-loss and low-crosstalk all-fiber-based six-mode multiplexer and demultiplexer for mode-multiplexed QAM signals in C-band
Igarashi, K., Wakayama, Y., Soma, D., Tsuritani, T., Morita, I., Park, K. J., Ko, J. & Kim, B. Y., 2018 6月 13, 2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 1-3 3 p. (2018 Optical Fiber Communications Conference and Exposition, OFC 2018 - Proceedings).研究成果: Conference contribution
3 被引用数 (Scopus) -
Low Loss ultra-compact Mach-Zehnder Modulator on Lithium Niobate Photonic Wire
Chunlen, J., Angkaew, T. & Kawanishi, T., 2019 7月, OECC/PSC 2019 - 24th OptoElectronics and Communications Conference/International Conference Photonics in Switching and Computing 2019. Institute of Electrical and Electronics Engineers Inc., 8818155. (OECC/PSC 2019 - 24th OptoElectronics and Communications Conference/International Conference Photonics in Switching and Computing 2019).研究成果: Conference contribution
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Low operating-energy directly modulated membrane distributed-reflector lasers on Si
Fujii, T., Takeda, K., Kanno, E., Hasebe, K., Nishi, H., Nakao, R., Yamamoto, T., Kakitsuka, T. & Matsuo, S., 2016, ECOC 2016; 42nd European Conference on Optical Communication. Institute of Electrical and Electronics Engineers Inc., p. 734-736 3 p. (European Conference on Optical Communication, ECOC).研究成果: Conference contribution
4 被引用数 (Scopus) -
Low-Operating Energy Heterogeneously Integrated Photonic-Crystal Laser on Si Waveguide
Nishi, H., Takeda, K., Fujii, T., Kuramochi, E., Shinya, A., Notomi, M., Tsuchizawa, T., Kakitsuka, T. & Matsuo, S., 2018 10月 30, 26th International Semiconductor Laser Conference, ISLC 2018. Institute of Electrical and Electronics Engineers Inc., p. 77-78 2 p. 8516174. (Conference Digest - IEEE International Semiconductor Laser Conference; vol. 2018-September).研究成果: Conference contribution
2 被引用数 (Scopus) -
Low-pass filter based VLSI oriented variable block size motion estimation algorithm for H.264
Zhenyu, L., Song, Y., Ikenaga, T. & Goto, S., 2006, 2006 IEEE International Conference on Acoustics, Speech, and Signal Processing - Proceedings. p. II253-II256 1660327. (ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings; vol. 2).研究成果: Conference contribution
7 被引用数 (Scopus) -
Low phase-delay reflection-type CRLH band-pass-filter
Nishino, T., Tsuru, M. & Miyazaki, M., 2006, Proceedings of the 36th European Microwave Conference, EuMC 2006. IEEE Computer Society, p. 745-748 4 p. 4057925. (Proceedings of the 36th European Microwave Conference, EuMC 2006).研究成果: Conference contribution
2 被引用数 (Scopus) -
Low phase noise photonic millimeter-wave generation by using a reciprocating optical modulator
Kawanishi, T., Sakamoto, T., Shinada, S., Izutsu, M., Oikawa, S. & Yoshiara, K., 2004 12月 1, Optical Fiber Communication Conference, OFC 2004 - Postconference Digest. p. 779-781 3 p. 1359652. (Conference on Optical Fiber Communication, Technical Digest Series; vol. 1).研究成果: Conference contribution
3 被引用数 (Scopus) -
Low-power and high-speed operation of InGaAsP/InP photonic crystal nanocavity laser using wavelength-sized buried heterostructure
Shinya, A., Matsuo, S., Kakitsuka, T., Nozaki, K., Segawa, T., Sato, T., Kawaguchi, Y. & Notomi, M., 2010 12月 1, Conference on Lasers and Electro-Optics, CLEO 2010. (Optics InfoBase Conference Papers).研究成果: Conference contribution
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Low-power and high-speed operation of InGaAsP/InP photonic crystal nanocavity laser using wavelength-sized buried heterostructure
Shinya, A., Matsuo, S., Kakitsuka, T., Nozaki, K., Segawa, T., Sato, T., Kawaguchi, Y. & Notomi, M., 2010, Conference on Lasers and Electro-Optics, CLEO 2010. Optical Society of America (OSA), (Optics InfoBase Conference Papers).研究成果: Conference contribution
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Low-power and high-speed operation of InGaAsP/InP photonic crystal nanocavity laser using wavelength-sized buried heterostructure
Shinya, A., Matsuo, S., Kakitsuka, T., Nozaki, K., Segawa, T., Sato, T., Kawaguchi, Y. & Notomi, M., 2010 10月 11, Lasers and Electro-Optics/Quantum Electronics and Laser Science Conference: 2010 Laser Science to Photonic Applications, CLEO/QELS 2010. 5500078. (Lasers and Electro-Optics/Quantum Electronics and Laser Science Conference: 2010 Laser Science to Photonic Applications, CLEO/QELS 2010).研究成果: Conference contribution
1 被引用数 (Scopus) -
Low power consumption Intelligent Local Avoided Collision (iLAC) MAC protocol for WLAN
Hieu, D. C., Van Tuan, L., Hieu, N. T., Masuda, A., Rabarijaona, V. H. & Shimamoto, S., 2012, 2012 IEEE International Symposium on Signal Processing and Information Technology, ISSPIT 2012. p. 1-6 6 p. 6621311. (2012 IEEE International Symposium on Signal Processing and Information Technology, ISSPIT 2012).研究成果: Conference contribution
1 被引用数 (Scopus) -
Low power consumption optical switches for high- to low-end applications
Utaka, K., 2012 12月 1, 2012 International Conference on Photonics in Switching, PS 2012. 6608343. (2012 International Conference on Photonics in Switching, PS 2012).研究成果: Conference contribution
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Low power parallel encoding system for video surveillance applications
Jin, X., Ba, K. & Goto, S., 2010, 2010 International SoC Design Conference, ISOCC 2010. p. 229-232 4 p. 5682929研究成果: Conference contribution
4 被引用数 (Scopus) -
Low power parallel surveillance video encoding system based on joint power-speed scheduling
Jin, X. & Goto, S., 2011, 2011 IEEE Visual Communications and Image Processing, VCIP 2011. 6115950研究成果: Conference contribution
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Low power surveillance video coding system
Jin, X., Ba, K. & Goto, S., 2010, 2010 IEEE International Conference on Multimedia and Expo, ICME 2010. p. 1156-1157 2 p. 5583167研究成果: Conference contribution
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Low power test compression technique for designs with multiple scan chains
Shi, Y., Togawa, N., Kimura, S., Yanagisawa, M. & Ohtsuki, T., 2005, Proceedings - 14th Asian Test Symposium, ATS 2005. p. 386-389 4 p. 1575460. (Proceedings of the Asian Test Symposium; vol. 2005).研究成果: Conference contribution
17 被引用数 (Scopus) -
Low-power ultra-wideband power detector IC in 130 nm CMOS technology
Yang, X., Uchida, Y., Liu, Q. & Yoshimasu, T., 2012 12月 20, IEEE MTT-S International Microwave Workshop Series on Millimeter Wave Wireless Technology and Applications, IMWS 2012 - Proceeding. p. 52-55 4 p. 6338206. (IEEE MTT-S International Microwave Workshop Series on Millimeter Wave Wireless Technology and Applications, IMWS 2012 - Proceeding).研究成果: Conference contribution
3 被引用数 (Scopus) -
Low profile double resonance frequency tunable antenna using RF MEMS variable capacitor for digital terrestrial broadcasting reception
Tsutsumi, Y., Nishio, M., Obayashi, S., Shoki, H., Ikehashi, T., Yamazaki, H., Ogawa, E., Saito, T., Ohguro, T. & Morooka, T., 2009, Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009. p. 125-128 4 p. 5357195. (Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009).研究成果: Conference contribution
6 被引用数 (Scopus) -
Low-rankness of Complex-valued Spectrogram and Its Application to Phase-aware Audio Processing
Masuyama, Y., Yatabe, K. & Oikawa, Y., 2019 5月, 2019 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2019 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 855-859 5 p. 8683100. (ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings; vol. 2019-May).研究成果: Conference contribution
13 被引用数 (Scopus) -
Low-rank tensor completion: A Riemannian manifold preconditioning approach
Kasai, H. & Mishra, B., 2016, 33rd International Conference on Machine Learning, ICML 2016. Weinberger, K. Q. & Balcan, M. F. (eds.). International Machine Learning Society (IMLS), p. 1576-1606 31 p. (33rd International Conference on Machine Learning, ICML 2016; vol. 3).研究成果: Conference contribution
29 被引用数 (Scopus) -
Low resolution character recognition by dual eigenspace and synthetic degraded patterns
Sun, J., Hotta, Y., Katsuyama, Y. & Naoi, S., 2004, HDP 2004: Proceedings of the First ACM Hardcopy Document Processing Workshop. Association for Computing Machinery (ACM), p. 15-22 8 p. (HDP 2004: Proceedings of the First ACM Hardcopy Document Processing Workshop).研究成果: Conference contribution
10 被引用数 (Scopus) -
Low-Resource Contextual Topic Identification on Speech
Liu, C., Wiesner, M., Watanabe, S., Harman, C., Trmal, J., Dehak, N. & Khudanpur, S., 2019 2月 11, 2018 IEEE Spoken Language Technology Workshop, SLT 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 656-663 8 p. 8639544. (2018 IEEE Spoken Language Technology Workshop, SLT 2018 - Proceedings).研究成果: Conference contribution
1 被引用数 (Scopus) -
Low T/|W| dynamical instabilities in differentially rotating stars: Diagnosis with canonical angular momentum
Saijo, M. & Yoshida, SI., 2006, AIP Conference Proceedings. Vol. 861. p. 728-735 8 p.研究成果: Conference contribution
2 被引用数 (Scopus) -
Low temperature, low pressure, fluxless and plateless Cu-Cu bonding by Cu nano particle transient liquid phase sintering
Yamamoto, T., Faiz, M. K., Suga, T., Miyashita, T. & Yoshida, M., 2017 12月 26, 2017 IEEE CPMT Symposium Japan, ICSJ 2017. Institute of Electrical and Electronics Engineers Inc., p. 139-140 2 p. (2017 IEEE CPMT Symposium Japan, ICSJ 2017; vol. 2017-January).研究成果: Conference contribution
1 被引用数 (Scopus) -
Low-temperature, surface-compliant wafer bonding using sub-micron gold particles for wafer-level MEMS packaging
Ishida, H., Ogashiwa, T., Kanehira, Y., Ito, S., Yazaki, T. & Mizuno, J., 2012 10月 4, 2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012. p. 1140-1145 6 p. 6248979. (Proceedings - Electronic Components and Technology Conference).研究成果: Conference contribution
8 被引用数 (Scopus) -
Low temperature all-Cu bonding via Cu-nanoparticle paste sintering in Pt-catalyzed formic acid vapor
Mu, F., Ren, H., Shin, S., Masatake, A., Liu, L., Zou, G., Makoto, Y. & Suga, T., 2019 5月, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., p. 53 1 p. 8735224. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).研究成果: Conference contribution
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Low temperature and low pressure bump bonding realized by single-micrometer Ag-nanoparticle bumps
Fu, W., Kasahara, T., Okada, A., Shoji, S., Shigetou, A. & Mizuno, J., 2014 1月 1, Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. IEEE Computer Society, 1 p. 6886186. (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014).研究成果: Conference contribution
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Low temperature and low pressure fluxless Cu-Cu bonding by Ag-based transient liquid phase sintering for high temperature application
Khairi Faiz, M., Yamamoto, T. & Yoshida, M., 2017 12月 26, 2017 IEEE CPMT Symposium Japan, ICSJ 2017. Institute of Electrical and Electronics Engineers Inc., p. 195-198 4 p. (2017 IEEE CPMT Symposium Japan, ICSJ 2017; vol. 2017-January).研究成果: Conference contribution
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Low-temperature anodic bonding of silicon and crystal quartz wafers for MEMS application
Zimin, Y. & Ueda, T., 2010, Proceedings of IEEE Sensors. p. 269-272 4 p. 5689857研究成果: Conference contribution
6 被引用数 (Scopus) -
Low temperature Au-Au bonding with VUV/O 3 treatment
Okada, A., Nimura, M., Unami, N., Shigetou, A., Noma, H., Sakuma, K., Mizuno, J. & Shoji, S., 2011, 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011. 6263015. (2011 IEEE International 3D Systems Integration Conference, 3DIC 2011).研究成果: Conference contribution
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Low temperature Au-Au flip chip bonding with VUV/O 3 treatment for 3D integration
Okada, A., Nimura, M., Unami, N., Shigetou, A., Noma, H., Sakuma, K., Shoji, S. & Mizuno, J., 2012, Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. p. 171 1 p. 6238082. (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012).研究成果: Conference contribution
1 被引用数 (Scopus) -
Low Temperature Bonding between Polyether Ether Ketone (PEEK) and Pt through Vapor Assisted VUV Surface Modification
Fu, W., Shigetou, A., Shoji, S. & Mizuno, J., 2016 8月 16, Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., Vol. 2016-August. p. 2541-2546 6 p. 7545784研究成果: Conference contribution
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Low-temperature bonding of a LiNbO3 waveguide chip to a Si substrate in ambient air for hybrid-integrated optical devices
Takigawa, R., Higurashi, E., Suga, T., Shinada, S. & Kawanishi, T., 2006 12月 1, Optomechatronic Micro/Nano Devices and Components II. 637603. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 6376).研究成果: Conference contribution
2 被引用数 (Scopus) -
Low temperature bonding process using mixed Cu-Ag nanoparticles for electronic packaging
Zou, G., Yan, J., Wang, X., Mu, F., Bai, H., Wu, A., Hu, A. & Zhou, Y. N., 2011 12月 1, Materials Science and Technology Conference and Exhibition 2011, MS and T'11. p. 1532-1538 7 p. (Materials Science and Technology Conference and Exhibition 2011, MS and T'11; vol. 2).研究成果: Conference contribution
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Low temperature bonding using sub-micron Au particles for wafer-level MEMS packaging
Ito, S., Mizuno, J., Ishida, H., Ogashiwa, T., Kanehira, Y., Murai, H., Wakai, F. & Shoji, S., 2012 12月 1, 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012. 6523451. (2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012).研究成果: Conference contribution
1 被引用数 (Scopus) -
Low temperature copper-copper quasi-direct bonding with ultrathin platinum intermediate layer using atomic layer deposition
Yamada, K., Kuwae, H., Kamibayashi, T., Momose, W., Shoji, S. & Mizuno, J., 2019 1月 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 123-126 4 p. 8625756. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).研究成果: Conference contribution
1 被引用数 (Scopus) -
Low temperature direct bonding of PEEK and Pt through VUV/FAB surface treatments
Fu, W., Shigetou, A., Shoji, S. & Mizuno, J., 2016 6月 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 302-305 4 p. 7486834. (2016 International Conference on Electronics Packaging, ICEP 2016).研究成果: Conference contribution
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Low temperature direct bonding of polyether ether ketone (PEEK) and Pt
Fu, W., Shigetou, A., Shoji, S. & Mizuno, J., 2015 12月 23, 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 217-220 4 p. 7365179研究成果: Conference contribution
2 被引用数 (Scopus) -
Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM)
Fu, W., Kuwae, H., Ma, B., Shoji, S. & Mizuno, J., 2017 6月 5, 2017 International Conference on Electronics Packaging, ICEP 2017. Institute of Electrical and Electronics Engineers Inc., p. 167-170 4 p. 7939349研究成果: Conference contribution
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Low temperature direct bonding of single crystal quartz substrates for high performance optical low pass filter using amorphous SiO2 intermediate layers
Ma, B., Kuwae, H., Okada, A., Fu, W., Shoji, S. & Mizuno, J., 2016 2月 26, MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., p. 25-28 4 p. 7421548. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); vol. 2016-February).研究成果: Conference contribution
3 被引用数 (Scopus) -
Low-temperature gold-gold bonding using selective formation of nanoporous powders for bump interconnects
Mimatsu, H., Mizuno, J., Kasahara, T., Saito, M., Shoji, S. & Nishikawa, H., 2014, MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., p. 1131-1134 4 p. 6765845. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).研究成果: Conference contribution
6 被引用数 (Scopus) -
Low-temperature wafer bonding using sub-micron gold particles for wafer-level MEMS packaging
Ishida, H., Ogashiwa, T., Kanehira, Y., Ito, S., Yazaki, T. & Mizuno, J., 2012 8月 15, Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 1 p. 6238083. (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012).研究成果: Conference contribution
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Low-voltage operation of 100-Gbit/s EADFB laser array module
Kanazawa, S., Fujisawa, T., Ohki, A., Ishii, H., Nunoya, N., Kawaguchi, Y., Fujiwara, N., Takahata, K., Iga, R., Kano, F. & Oohashi, H., 2010 12月 1, 2010 22nd IEEE International Semiconductor Laser Conference, ISLC 2010. p. 57-58 2 p. 5642753. (Conference Digest - IEEE International Semiconductor Laser Conference).研究成果: Conference contribution
3 被引用数 (Scopus) -
Low volume aerobic training heightens muscle deoxygenation in early post-angina pectoris patients
Takagi, S., Murase, N., Kime, R., Niwayama, M., Osada, T. & Katsumura, T., 2016, Oxygen Transport to Tissue XXXVIII. Springer New York LLC, Vol. 923. p. 255-261 7 p. (Advances in Experimental Medicine and Biology; vol. 923).研究成果: Conference contribution