A 137-mW, 4 ch x 25-Gbps low-power compact transmitter Flip-Chip-Bonded 1.3-μm LD-Array-on-Si

Toshiki Kishi, Munehiko Nagatani, Shigeru Kanazawa, Shinsuke Nakano, Hiroaki Katsurai, Takuro Fujii, Hidetaka Nishi, Takaaki Kakitsuka, Koichi Hasebe, Kota Shikama, Yuko Kawajiri, Atsushi Aratake, Hideyuki Nosaka, Hiroshi Fukuda, Shinji Matsuo

研究成果: Conference contribution

抜粋

A low-power compact 4-channel transmitter consisting of a 65-nm CMOS cascode shunt LD driver and flip-chip-bonded 1.3-μm LD-array-on-Si achieves 25-Gbps 2-km-long SSMF error-free operation for each channel, with power consumption of 1.37 mW/Gbps.

元の言語English
ホスト出版物のタイトルOptical Fiber Communication Conference, OFC 2018
出版者OSA - The Optical Society
ISBN(電子版)9781557528209
DOI
出版物ステータスPublished - 2018
外部発表Yes
イベントOptical Fiber Communication Conference, OFC 2018 - San Diego, United States
継続期間: 2017 3 112017 3 15

出版物シリーズ

名前Optics InfoBase Conference Papers
Part F84-OFC 2018

Other

OtherOptical Fiber Communication Conference, OFC 2018
United States
San Diego
期間17/3/1117/3/15

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials

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  • これを引用

    Kishi, T., Nagatani, M., Kanazawa, S., Nakano, S., Katsurai, H., Fujii, T., Nishi, H., Kakitsuka, T., Hasebe, K., Shikama, K., Kawajiri, Y., Aratake, A., Nosaka, H., Fukuda, H., & Matsuo, S. (2018). A 137-mW, 4 ch x 25-Gbps low-power compact transmitter Flip-Chip-Bonded 1.3-μm LD-Array-on-Si. : Optical Fiber Communication Conference, OFC 2018 (Optics InfoBase Conference Papers; 巻数 Part F84-OFC 2018). OSA - The Optical Society. https://doi.org/10.1364/OFC.2018.M2D.2