A 0.5-mm-thick Cadmium Telluride (CdTe) semiconductor pixel sensor with 1024 pixels has been bump-bonded onto a two-dimensional (2-D) single photon counting pixel read out chip (MPEC 2.1) using a special gold-stud technique. The pixel size is 200 × 200 μm2, the active area is 6.4 × 6.4 mm2. The successful operation of this high-Z imaging pixel device is demonstrated. Noise and threshold dispersion as well as the imaging performance are reported.
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Nuclear Energy and Engineering