A method of "chemical flip-chip bonding" without loading and heating for ultra-fine chip-to-substrate interconnects

Tokihiko Yokoshima, Yasuhiro Yamaji, Katsuya Kikuchi, Hiroshi Nakagawa, Masahiro Aoyagi

研究成果: Conference contribution

4 引用 (Scopus)

抜粋

A method of chemical flip-chip bonding by electroless deposition process was proposed. This method positively utilizes preferential bridge deposition between metal pads in electroless Ni-B deposition and enables bump-less interconnect without loading and/or heating at lower temperature (60°C). Details of the deposition behavior for interconnection were investigated using fundamental test chips. The selection not only of various dimensions of pad design and pad-to-pad configurations but also of materials of base materials, was very important to achieve preferential bridge connection. Preferential bridge connections show high electric resistance because of using high resistivity materials with thin thickness. In the investigation of chip-to-substrate bonding, the low resistance interconnection could be achieved with combination usage of preferential bridge deposition and conventional electroless Au deposition from non-cyanide bath. The electric resistance of the interconnection decreased to less than one-20th, dramatically.

元の言語English
ホスト出版物のタイトル2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009
ページ80-86
ページ数7
DOI
出版物ステータスPublished - 2009 10 12
外部発表Yes
イベント2009 59th Electronic Components and Technology Conference, ECTC 2009 - San Diego, CA, United States
継続期間: 2009 5 262009 5 29

出版物シリーズ

名前Proceedings - Electronic Components and Technology Conference
ISSN(印刷物)0569-5503

Conference

Conference2009 59th Electronic Components and Technology Conference, ECTC 2009
United States
San Diego, CA
期間09/5/2609/5/29

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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  • これを引用

    Yokoshima, T., Yamaji, Y., Kikuchi, K., Nakagawa, H., & Aoyagi, M. (2009). A method of "chemical flip-chip bonding" without loading and heating for ultra-fine chip-to-substrate interconnects. : 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009 (pp. 80-86). [5074000] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2009.5074000