A method of "chemical flip-chip bonding" without loading and heating for ultra-fine chip-to-substrate interconnects

Tokihiko Yokoshima*, Yasuhiro Yamaji, Katsuya Kikuchi, Hiroshi Nakagawa, Masahiro Aoyagi

*この研究の対応する著者

研究成果: Conference contribution

4 被引用数 (Scopus)

抄録

A method of chemical flip-chip bonding by electroless deposition process was proposed. This method positively utilizes preferential bridge deposition between metal pads in electroless Ni-B deposition and enables bump-less interconnect without loading and/or heating at lower temperature (60°C). Details of the deposition behavior for interconnection were investigated using fundamental test chips. The selection not only of various dimensions of pad design and pad-to-pad configurations but also of materials of base materials, was very important to achieve preferential bridge connection. Preferential bridge connections show high electric resistance because of using high resistivity materials with thin thickness. In the investigation of chip-to-substrate bonding, the low resistance interconnection could be achieved with combination usage of preferential bridge deposition and conventional electroless Au deposition from non-cyanide bath. The electric resistance of the interconnection decreased to less than one-20th, dramatically.

本文言語English
ホスト出版物のタイトル2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009
ページ80-86
ページ数7
DOI
出版ステータスPublished - 2009 10月 12
外部発表はい
イベント2009 59th Electronic Components and Technology Conference, ECTC 2009 - San Diego, CA, United States
継続期間: 2009 5月 262009 5月 29

出版物シリーズ

名前Proceedings - Electronic Components and Technology Conference
ISSN(印刷版)0569-5503

Conference

Conference2009 59th Electronic Components and Technology Conference, ECTC 2009
国/地域United States
CitySan Diego, CA
Period09/5/2609/5/29

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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