A method of fabricating bump-less interconnects applicable to wafer-scale flip-chip bonding

Yasuhiro Yamaji, Tokihiko Yokoshima, Noboru Igawa, Katsuya Kikuchi, Hiroshi Nakagawa, Masahiro Aoyagi

研究成果: Conference contribution

4 引用 (Scopus)

抜粋

A chemical flip-chip bonding method by electroless plating process has been developed. This method positively utilizes so-called "bridge" phenomenon between metal pads in electroless Ni-B plating, and enables bump-less interconnect without loading and/or heating at lower temperature (60°C). The interconnect behavior was examined using test chips and substrates with various pad-to-pad configurations. The result confirmed that effective pad width and a ratio of pad pitch to pad width determine the completeness of the interconnection under the condition that distance between facing pads are sufficiently close. A potential of improved method was also demonstrated for fabricating finer pitch flip-chip interconnect with a minimum pad-pitch of 20 μm.

元の言語English
ホスト出版物のタイトル10th Electronics Packaging Technology Conference, EPTC 2008
ページ657-662
ページ数6
DOI
出版物ステータスPublished - 2008 12 1
外部発表Yes
イベント10th Electronics Packaging Technology Conference, EPTC 2008 - Singapore, Singapore
継続期間: 2008 12 92008 12 12

出版物シリーズ

名前10th Electronics Packaging Technology Conference, EPTC 2008

Conference

Conference10th Electronics Packaging Technology Conference, EPTC 2008
Singapore
Singapore
期間08/12/908/12/12

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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  • これを引用

    Yamaji, Y., Yokoshima, T., Igawa, N., Kikuchi, K., Nakagawa, H., & Aoyagi, M. (2008). A method of fabricating bump-less interconnects applicable to wafer-scale flip-chip bonding. : 10th Electronics Packaging Technology Conference, EPTC 2008 (pp. 657-662). [4763508] (10th Electronics Packaging Technology Conference, EPTC 2008). https://doi.org/10.1109/EPTC.2008.4763508