A novel expression of spatial correlation by a random curved surface model and its application to LSI design

Ohkawa Shin-ichi*, Hiroo Masuda, Yasuaki Inoue

*この研究の対応する著者

    研究成果: Article査読

    1 被引用数 (Scopus)

    抄録

    We have proposed a random curved surface model as a new mathematical concept which enables the expression of spatial corre-lation. The model gives us an appropriate methodology to deal with the systematic components of device variation in an LSI chip. The key idea of the model is the fitting of a polynomial to an array of Gaussian random numbers. The curved surface is expressed by a new extension from the Legendre polynomials to form two-dimensional formulas. The formulas were proven to be suitable to express the spatial correlation with reasonable computational complexity. In this paper, we show that this approach is useful in analyzing characteristics of device variation of actual chips by using experimental data.

    本文言語English
    ページ(範囲)1062-1070
    ページ数9
    ジャーナルIEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences
    E91-A
    4
    DOI
    出版ステータスPublished - 2008

    ASJC Scopus subject areas

    • 電子工学および電気工学
    • コンピュータ グラフィックスおよびコンピュータ支援設計
    • 応用数学
    • 信号処理

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