A novel lift off process and its application for capacitive tilt sensor

Jinxing Liang, Fusao Kohsaka, Takahiro Matsuo, Toshitsugu Ueda

    研究成果: Conference contribution

    6 被引用数 (Scopus)

    抄録

    This paper presents a novel bi-layer (top image resist Shipley S1808 and bottom liftoff resist LOL2000) lift off process for patterning 3-D devices. Resists are coated and patterned with an overhang profile on substrate before it is etched and before the film deposition. The key feature of the new lift off process is to create a resist undercut profile, which should be deep enough to reduce step coverage and durable to aggressive substrate etchant. Two-step development method was demonstrated effective. The resist profile is optimized by development time in the two step development process. Proposed lift off process was successively used for fabricating quartz based capacitive tilt sensor.

    本文言語English
    ホスト出版物のタイトルProceedings of IEEE Sensors
    ページ1422-1425
    ページ数4
    DOI
    出版ステータスPublished - 2006
    イベント2006 5th IEEE Conference on Sensors - Daegu
    継続期間: 2006 10 222006 10 25

    Other

    Other2006 5th IEEE Conference on Sensors
    CityDaegu
    Period06/10/2206/10/25

    ASJC Scopus subject areas

    • Engineering (miscellaneous)
    • Electrical and Electronic Engineering

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