A performance enhanced adaptive routing algorithm for 3D Network-on-Chips

Lian Zeng; Tieyuan Pan; Xin Jiang; Takahiro Watanabe

doi:10.1109/TENCON.2015.7373036

A performance enhanced adaptive routing algorithm for 3D Network-on-Chips

Lian Zeng, Tieyuan Pan, Xin Jiang, Takahiro Watanabe

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

As the technology of semiconductor continues to develop, hundreds of cores will be deployed on a signal die in the future Chip-Multiprocessors (CMPs) design. So Three-Dimensional Network-on-Chips (3D NoCs) has become an attractive solution which can provide high performance. The network performance depends critically on the performance of routing algorithm. This paper proposes a novel adaptive routing in 3D NoC which can solve congestion not only in the intra-layers but also in inter-layers. Simulation results show that our proposed method significantly achieves the performance improvement compared with other transitional routing algorithms.

本文言語	English
ホスト出版物のタイトル	IEEE Region 10 Annual International Conference, Proceedings/TENCON
出版社	Institute of Electrical and Electronics Engineers Inc.
巻	2016-January
ISBN（印刷版）	9781479986415
DOI	https://doi.org/10.1109/TENCON.2015.7373036
出版ステータス	Published - 2016 1 5
イベント	35th IEEE Region 10 Conference, TENCON 2015 - Macau, Macao 継続期間: 2015 11 1 → 2015 11 4

Other

Other	35th IEEE Region 10 Conference, TENCON 2015
Country	Macao
City	Macau
Period	15/11/1 → 15/11/4

ASJC Scopus subject areas

Electrical and Electronic Engineering
Computer Science Applications

文献へのアクセス

10.1109/TENCON.2015.7373036

フィンガープリント「A performance enhanced adaptive routing algorithm for 3D Network-on-Chips」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル

Zeng, L, Pan, T, Jiang, X & Watanabe, T 2016, A performance enhanced adaptive routing algorithm for 3D Network-on-Chips. in IEEE Region 10 Annual International Conference, Proceedings/TENCON. vol. 2016-January, 7373036, Institute of Electrical and Electronics Engineers Inc., 35th IEEE Region 10 Conference, TENCON 2015, Macau, Macao, 15/11/1. https://doi.org/10.1109/TENCON.2015.7373036

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