A performance enhanced adaptive routing algorithm for 3D Network-on-Chips

Lian Zeng, Tieyuan Pan, Xin Jiang, Takahiro Watanabe

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

As the technology of semiconductor continues to develop, hundreds of cores will be deployed on a signal die in the future Chip-Multiprocessors (CMPs) design. So Three-Dimensional Network-on-Chips (3D NoCs) has become an attractive solution which can provide high performance. The network performance depends critically on the performance of routing algorithm. This paper proposes a novel adaptive routing in 3D NoC which can solve congestion not only in the intra-layers but also in inter-layers. Simulation results show that our proposed method significantly achieves the performance improvement compared with other transitional routing algorithms.

本文言語English
ホスト出版物のタイトルIEEE Region 10 Annual International Conference, Proceedings/TENCON
出版社Institute of Electrical and Electronics Engineers Inc.
2016-January
ISBN(印刷版)9781479986415
DOI
出版ステータスPublished - 2016 1 5
イベント35th IEEE Region 10 Conference, TENCON 2015 - Macau, Macao
継続期間: 2015 11 12015 11 4

Other

Other35th IEEE Region 10 Conference, TENCON 2015
CountryMacao
CityMacau
Period15/11/115/11/4

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Computer Science Applications

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