抄録
As the technology of semiconductor continues to develop, hundreds of cores will be deployed on a signal die in the future Chip-Multiprocessors (CMPs) design. So Three-Dimensional Network-on-Chips (3D NoCs) has become an attractive solution which can provide high performance. The network performance depends critically on the performance of routing algorithm. This paper proposes a novel adaptive routing in 3D NoC which can solve congestion not only in the intra-layers but also in inter-layers. Simulation results show that our proposed method significantly achieves the performance improvement compared with other transitional routing algorithms.
本文言語 | English |
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ホスト出版物のタイトル | IEEE Region 10 Annual International Conference, Proceedings/TENCON |
出版社 | Institute of Electrical and Electronics Engineers Inc. |
巻 | 2016-January |
ISBN(印刷版) | 9781479986415 |
DOI | |
出版ステータス | Published - 2016 1月 5 |
イベント | 35th IEEE Region 10 Conference, TENCON 2015 - Macau, Macao 継続期間: 2015 11月 1 → 2015 11月 4 |
Other
Other | 35th IEEE Region 10 Conference, TENCON 2015 |
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国/地域 | Macao |
City | Macau |
Period | 15/11/1 → 15/11/4 |
ASJC Scopus subject areas
- 電子工学および電気工学
- コンピュータ サイエンスの応用