A sorting-based micro-bump assignment for 3D ICs

Ran Zhang, Tieyuan Pan, Takahiro Watanabe

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

Recently RDLs (Re-Distribution Layers) and micro-bumps are widely adopted in 3D IC designs. In this research, a sorting-based micro-bump assignment method is proposed. The approach initially assigns the I/O pads to micro-bumps by sorting the Manhattan distance between them. Then single layer routing in two RDLs are carried out respectively. The experimental results show that the proposed method is able to obtain the routes with shorter total wire length in reasonable CPU times.

本文言語English
ホスト出版物のタイトルISOCC 2015 - International SoC Design Conference: SoC for Internet of Everything (IoE)
出版社Institute of Electrical and Electronics Engineers Inc.
ページ139-140
ページ数2
ISBN(印刷版)9781467393089
DOI
出版ステータスPublished - 2016 2 8
イベント12th International SoC Design Conference, ISOCC 2015 - Gyeongju, Korea, Republic of
継続期間: 2015 11 22015 11 5

Other

Other12th International SoC Design Conference, ISOCC 2015
国/地域Korea, Republic of
CityGyeongju
Period15/11/215/11/5

ASJC Scopus subject areas

  • ハードウェアとアーキテクチャ
  • 電子工学および電気工学
  • 電子材料、光学材料、および磁性材料

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