A study on low temperature SAM modified POM direct bonding affected by VUV/O3 irradiation

研究成果: Conference contribution

1 引用 (Scopus)

抄録

A direct bonding of polyoxymethelene (POM) was feasible at 100 °C by using self-assembled monolayers (SAM) as surface modification method. (3-Aminopropyl)triethoxysilane (APTES) and (3-Glycidyloxypropyl)trimethoxysilane (GOPTS) were applied in our work. Surface modification carried out with different VUV/O3 irradiation conditions showed different bonding strength. In addition, the bonding condition with highest strength had an average strength of 0.37 MPa. This technology was expected to be used in packaging for micro/nano electromechanical systems (MEMS/NMES), such as bio-/medical devices.

元の言語English
ホスト出版物のタイトルProceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
出版者Institute of Electrical and Electronics Engineers Inc.
ページ69
ページ数1
ISBN(電子版)9784904743034
DOI
出版物ステータスPublished - 2017 6 13
イベント5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 - Tokyo, Japan
継続期間: 2017 5 162017 5 18

Other

Other5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
Japan
Tokyo
期間17/5/1617/5/18

Fingerprint

Self assembled monolayers
Irradiation
Surface treatment
Temperature
MEMS
Packaging

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films

これを引用

Fu, W., Ma, B., Kuwae, H., Shoji, S., & Mizuno, J. (2017). A study on low temperature SAM modified POM direct bonding affected by VUV/O3 irradiation. : Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 (pp. 69). [7947465] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/LTB-3D.2017.7947465

A study on low temperature SAM modified POM direct bonding affected by VUV/O3 irradiation. / Fu, Weixin; Ma, Bo; Kuwae, Hiroyuki; Shoji, Shuichi; Mizuno, Jun.

Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 69 7947465.

研究成果: Conference contribution

Fu, W, Ma, B, Kuwae, H, Shoji, S & Mizuno, J 2017, A study on low temperature SAM modified POM direct bonding affected by VUV/O3 irradiation. : Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017., 7947465, Institute of Electrical and Electronics Engineers Inc., pp. 69, 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017, Tokyo, Japan, 17/5/16. https://doi.org/10.23919/LTB-3D.2017.7947465
Fu W, Ma B, Kuwae H, Shoji S, Mizuno J. A study on low temperature SAM modified POM direct bonding affected by VUV/O3 irradiation. : Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 69. 7947465 https://doi.org/10.23919/LTB-3D.2017.7947465
Fu, Weixin ; Ma, Bo ; Kuwae, Hiroyuki ; Shoji, Shuichi ; Mizuno, Jun. / A study on low temperature SAM modified POM direct bonding affected by VUV/O3 irradiation. Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 69
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