抄録
A direct bonding of polyoxymethelene (POM) was feasible at 100 °C by using self-assembled monolayers (SAM) as surface modification method. (3-Aminopropyl)triethoxysilane (APTES) and (3-Glycidyloxypropyl)trimethoxysilane (GOPTS) were applied in our work. Surface modification carried out with different VUV/O3 irradiation conditions showed different bonding strength. In addition, the bonding condition with highest strength had an average strength of 0.37 MPa. This technology was expected to be used in packaging for micro/nano electromechanical systems (MEMS/NMES), such as bio-/medical devices.
本文言語 | English |
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ホスト出版物のタイトル | Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 |
出版社 | Institute of Electrical and Electronics Engineers Inc. |
ページ | 69 |
ページ数 | 1 |
ISBN(電子版) | 9784904743034 |
DOI | |
出版ステータス | Published - 2017 6月 13 |
イベント | 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 - Tokyo, Japan 継続期間: 2017 5月 16 → 2017 5月 18 |
Other
Other | 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 |
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国/地域 | Japan |
City | Tokyo |
Period | 17/5/16 → 17/5/18 |
ASJC Scopus subject areas
- 電子工学および電気工学
- 産業および生産工学
- 電子材料、光学材料、および磁性材料
- 表面、皮膜および薄膜