A study on low temperature SAM modified POM direct bonding affected by VUV/O3 irradiation

Weixin Fu, Bo Ma, Hiroyuki Kuwae, Shuichi Shoji, Jun Mizuno

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

A direct bonding of polyoxymethelene (POM) was feasible at 100 °C by using self-assembled monolayers (SAM) as surface modification method. (3-Aminopropyl)triethoxysilane (APTES) and (3-Glycidyloxypropyl)trimethoxysilane (GOPTS) were applied in our work. Surface modification carried out with different VUV/O3 irradiation conditions showed different bonding strength. In addition, the bonding condition with highest strength had an average strength of 0.37 MPa. This technology was expected to be used in packaging for micro/nano electromechanical systems (MEMS/NMES), such as bio-/medical devices.

本文言語English
ホスト出版物のタイトルProceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
出版社Institute of Electrical and Electronics Engineers Inc.
ページ69
ページ数1
ISBN(電子版)9784904743034
DOI
出版ステータスPublished - 2017 6月 13
イベント5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 - Tokyo, Japan
継続期間: 2017 5月 162017 5月 18

Other

Other5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
国/地域Japan
CityTokyo
Period17/5/1617/5/18

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 産業および生産工学
  • 電子材料、光学材料、および磁性材料
  • 表面、皮膜および薄膜

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