A Study on the Low Energy Consumption Thermal Head Using Electroless Ni-W-P Alloy Films as Heating Resistors

Hideo Sawai, Takashi Kanamori, Ichiro Koiwa, Susumu Shibata, Koji Nihei, Tetsuya Osaka

研究成果: Article査読

17 被引用数 (Scopus)

抄録

The new type of thermal head with an electroless Ni-W-P film on a polyimide film substrate was investigated for the purpose of low cost and low energy consumption. The electroless plating method attained a fine patterned heating element and the polyimide substrate worked as a heat-insulating layer with a lower heat conductivity. In our simulation, the applied power was reduced about 50% by using polyimide film as the heat-insulating layer. The accumulation of heat could be suppressed by controlling the polyimide film thickness without reducing the advantage of low energy consumption. The new head, composed of screen-printed polyimide resin with SiC powder (10 µm thick) as the protective layer, an electroless Ni-W-P film (0.25 µm thick) as the heating element, a polyimide film (50 µm thick) as the heat-insulating layer, and an Al board (3.0 mm) as the heat sink, was produced. The new head shows the same dot size as that of the conventional thin-film-type head produced by vacuum technology, and its cost is lower than that of the conventional thin-film-type head. The new head produces the good printing quality with 60% of the power required by the conventional one. Therefore, the new head provides low cost and low energy consumption.

本文言語English
ページ(範囲)3653-3660
ページ数8
ジャーナルJournal of the Electrochemical Society
137
11
DOI
出版ステータスPublished - 1990 11月

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 再生可能エネルギー、持続可能性、環境
  • 表面、皮膜および薄膜
  • 電気化学
  • 材料化学

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