A via hole based superconducting wiring method for enhanced X-ray image sensors

H. Kudo, S. Ohtsuka, T. Arakawa, T. Izumi, Shuichi Shoji, H. Sato, H. Kobayashi, K. Mori, Takayuki Homma, Tetsuya Osaka, K. Mitsuda, N. Y. Yamasaki, R. Fujimoto, N. Iyomoto, T. Oshima, K. Futamoto, Y. Takei, T. Ichitsubo, T. Fujimori, Y. IshisakiU. Morita, T. Koga, K. Sato, T. Ohashi, Y. Kuroda, M. Onishi, K. Otake

研究成果: Conference contribution

抜粋

In this paper we developed through-wafer interconnections using only a simple fabrication process. The interconnection was successfully transformed into the superconducting state. A current density of 13 cm/sup 2//mA was obtained in the superconducting state. We realize high energy-resolution X-ray imaging using the superconducting through-wafer interconnections.

元の言語English
ホスト出版物のタイトルDigest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003
出版者Institute of Electrical and Electronics Engineers Inc.
ページ182-183
ページ数2
ISBN(印刷物)4891140402, 9784891140403
DOI
出版物ステータスPublished - 2003
イベントInternational Microprocesses and Nanotechnology Conference, MNC 2003 - Tokyo, Japan
継続期間: 2003 10 292003 10 31

Other

OtherInternational Microprocesses and Nanotechnology Conference, MNC 2003
Japan
Tokyo
期間03/10/2903/10/31

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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  • これを引用

    Kudo, H., Ohtsuka, S., Arakawa, T., Izumi, T., Shoji, S., Sato, H., Kobayashi, H., Mori, K., Homma, T., Osaka, T., Mitsuda, K., Yamasaki, N. Y., Fujimoto, R., Iyomoto, N., Oshima, T., Futamoto, K., Takei, Y., Ichitsubo, T., Fujimori, T., ... Otake, K. (2003). A via hole based superconducting wiring method for enhanced X-ray image sensors. : Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003 (pp. 182-183). [1268635] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IMNC.2003.1268635