A via hole based superconducting wiring method for enhanced X-ray image sensors

H. Kudo, S. Ohtsuka, T. Arakawa, T. Izumi, Shuichi Shoji, H. Sato, H. Kobayashi, K. Mori, Takayuki Homma, Tetsuya Osaka, K. Mitsuda, N. Y. Yamasaki, R. Fujimoto, N. Iyomoto, T. Oshima, K. Futamoto, Y. Takei, T. Ichitsubo, T. Fujimori, Y. IshisakiU. Morita, T. Koga, K. Sato, T. Ohashi, Y. Kuroda, M. Onishi, K. Otake

研究成果: Conference contribution

抄録

In this paper we developed through-wafer interconnections using only a simple fabrication process. The interconnection was successfully transformed into the superconducting state. A current density of 13 cm/sup 2//mA was obtained in the superconducting state. We realize high energy-resolution X-ray imaging using the superconducting through-wafer interconnections.

本文言語English
ホスト出版物のタイトルDigest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003
出版社Institute of Electrical and Electronics Engineers Inc.
ページ182-183
ページ数2
ISBN(印刷版)4891140402, 9784891140403
DOI
出版ステータスPublished - 2003
イベントInternational Microprocesses and Nanotechnology Conference, MNC 2003 - Tokyo, Japan
継続期間: 2003 10 292003 10 31

Other

OtherInternational Microprocesses and Nanotechnology Conference, MNC 2003
CountryJapan
CityTokyo
Period03/10/2903/10/31

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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