Advanced surface finishing technology for electronics application

研究成果: Paper査読

抄録

Extensively used in electronics application are electroplating and electroless-plating methods. The printed wiring boards (PWB), in order to raise the packing density, uses both techniques to employ higher multi-layer and higher surface density. Described in the paper is advanced surface finishing in electronics application. Plating technique has become an important key technology in this field. Its increased usage and applications are seen to take place in the future.

本文言語English
ページ421-424
ページ数4
出版ステータスPublished - 1993 12 1
イベントProceedings of the 80th AESF Annual Technical Conference - Anaheim, CA, USA
継続期間: 1993 6 211993 6 24

Other

OtherProceedings of the 80th AESF Annual Technical Conference
CityAnaheim, CA, USA
Period93/6/2193/6/24

ASJC Scopus subject areas

  • Mechanical Engineering
  • Metals and Alloys

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