Extensively used in electronics application are electroplating and electroless-plating methods. The printed wiring boards (PWB), in order to raise the packing density, uses both techniques to employ higher multi-layer and higher surface density. Described in the paper is advanced surface finishing in electronics application. Plating technique has become an important key technology in this field. Its increased usage and applications are seen to take place in the future.
|出版ステータス||Published - 1993 12 1|
|イベント||Proceedings of the 80th AESF Annual Technical Conference - Anaheim, CA, USA|
継続期間: 1993 6 21 → 1993 6 24
|Other||Proceedings of the 80th AESF Annual Technical Conference|
|City||Anaheim, CA, USA|
|Period||93/6/21 → 93/6/24|
ASJC Scopus subject areas