Micro-ball wafer bumping method was applied to forming double ball bumps, which increased the bump height to improve the reliability of the flip chip interconnection. The micro solder balls of 100um in diameter were transferred and connected to the whole electrode-pads covered with UBMs(Under Bump Metals) of an 8 inch wafer in one stroke using a fully automated micro ball mounter, which was originally developed. The balls were held on fluxed pads and melted in a reflow furnace. After cleaning the flux residue, the wafer bumped with micro-balls was then encapsulated with epoxy resin containing silica fillers by using Apic Yamada's wafer level molding system. The molding resin was spread to the whole wafer by compressing with a heated flat plate, where the top of the solder bumps were covered with an elastic parting film. The supplied resin volume was previously adjusted to the desired molding thickness. The exposed top of the ball bumps was cleaned and then second micro-ball bumping was processed on the top of the first bumps. The first and second balls were connected by reflowing to form the double ball bumps. The height variation and shear strength of double ball bumps were evaluated. To compare the reliability for the different type of bumps the TCTs and FEM analysis were performed for the chips connected with PCBs.
|ジャーナル||Proceedings - Electronic Components and Technology Conference|
|出版ステータス||Published - 2005|
|イベント||55th Electronic Components and Technology Conference, ECTC - Lake Buena Vista, FL, United States|
継続期間: 2005 5月 31 → 2005 6月 4
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