An efficient algorithm for 3D-IC TSV assignment

Cong Hao, Nan Ding, Takeshi Yoshimura

研究成果: Conference contribution

4 引用 (Scopus)

抜粋

In this work we solve the 3D-IC TSV assignment which is formulated as an Integer Minimum Cost Multi Commodity (IMCMC) problem. We propose a multi-level algorithm including graph coarsening and un-coarsening, to greatly reduce the IMCMC problem size; benefiting from it, we transform the IMCMC problem into a mixed single and multi commodity problem and partially solved it using min-cost flow method. Further, we extend the layer by layer method for TSV assignment optimization. The experimental results shows that the our proposal generates initial solutions with 2.8% wire length reduction compared to the existing work, and our extended layer by layer method achieves another 1.7% improvement with slight time overhead.

元の言語English
ホスト出版物のタイトル14th IEEE International NEWCAS Conference, NEWCAS 2016
出版者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子版)9781467389006
DOI
出版物ステータスPublished - 2016 10 20
イベント14th IEEE International NEWCAS Conference, NEWCAS 2016 - Vancouver, Canada
継続期間: 2016 6 262016 6 29

Other

Other14th IEEE International NEWCAS Conference, NEWCAS 2016
Canada
Vancouver
期間16/6/2616/6/29

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Electrical and Electronic Engineering

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  • これを引用

    Hao, C., Ding, N., & Yoshimura, T. (2016). An efficient algorithm for 3D-IC TSV assignment. : 14th IEEE International NEWCAS Conference, NEWCAS 2016 [7604740] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/NEWCAS.2016.7604740