An efficient algorithm for 3D-IC TSV assignment

Cong Hao, Nan Ding, Takeshi Yoshimura

研究成果: Conference contribution

4 被引用数 (Scopus)

抄録

In this work we solve the 3D-IC TSV assignment which is formulated as an Integer Minimum Cost Multi Commodity (IMCMC) problem. We propose a multi-level algorithm including graph coarsening and un-coarsening, to greatly reduce the IMCMC problem size; benefiting from it, we transform the IMCMC problem into a mixed single and multi commodity problem and partially solved it using min-cost flow method. Further, we extend the layer by layer method for TSV assignment optimization. The experimental results shows that the our proposal generates initial solutions with 2.8% wire length reduction compared to the existing work, and our extended layer by layer method achieves another 1.7% improvement with slight time overhead.

本文言語English
ホスト出版物のタイトル14th IEEE International NEWCAS Conference, NEWCAS 2016
出版社Institute of Electrical and Electronics Engineers Inc.
ISBN(電子版)9781467389006
DOI
出版ステータスPublished - 2016 10 20
イベント14th IEEE International NEWCAS Conference, NEWCAS 2016 - Vancouver, Canada
継続期間: 2016 6 262016 6 29

Other

Other14th IEEE International NEWCAS Conference, NEWCAS 2016
国/地域Canada
CityVancouver
Period16/6/2616/6/29

ASJC Scopus subject areas

  • コンピュータ ネットワークおよび通信
  • 電子工学および電気工学

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