An Embedded SiC Module with Using NMPB Interconnection for Chevron Shaped Cu Lead and Electrodes

Naoki Fukui, Keiko Koshiba, Itaru Miyazaki, Isamu Morisako, Tomonori Iizuka, Tomoya Itose, Masayuki Hikita, Rikiya Kamimura, Kohei Tatsumi

研究成果: Conference contribution

抜粋

As for the IGBT power device based on Si used for the vehicle, the performance limit of the Si semiconductor has been pointed out, and the SiC semiconductor has been attracting attention as a next-generation semiconductor. The SiC semiconductor has advantages such as a wider band gap, a larger breakdown electric field, and high temperature operation (about 300 ° C.). If these features can be maximized, a SiC power semiconductor module that can be significantly improved in efficiency, downsized, and operable in a high-temperature environment as compared with a Si semiconductor can be more widely implemented.In this study, two sets of SiC-MOS and SiC-SBD devices are embedded in a ceramic substrate, and their electrodes and the copper electrodes of the substrate are interconnected by NMPB (Nickel Micro-plating Bonding) method, so that one-leg prototype inverter modules of a highly heat-resistant and ultra-small size (47x30x1.3mm) could be manufactured. The NMPB method is a technology that we have originally developed to connect a chip electrode and a lead formed in a chevron shape by Ni plating. High-temperature operation and excellent switching characteristics of the SiC power module were demonstrated.

元の言語English
ホスト出版物のタイトルProceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020
出版者Institute of Electrical and Electronics Engineers Inc.
ページ2226-2229
ページ数4
ISBN(電子版)9781728161808
DOI
出版物ステータスPublished - 2020 6
イベント70th IEEE Electronic Components and Technology Conference, ECTC 2020 - Orlando, United States
継続期間: 2020 6 32020 6 30

出版物シリーズ

名前Proceedings - Electronic Components and Technology Conference
2020-June
ISSN(印刷物)0569-5503

Conference

Conference70th IEEE Electronic Components and Technology Conference, ECTC 2020
United States
Orlando
期間20/6/320/6/30

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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  • これを引用

    Fukui, N., Koshiba, K., Miyazaki, I., Morisako, I., Iizuka, T., Itose, T., Hikita, M., Kamimura, R., & Tatsumi, K. (2020). An Embedded SiC Module with Using NMPB Interconnection for Chevron Shaped Cu Lead and Electrodes. : Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020 (pp. 2226-2229). [9159375] (Proceedings - Electronic Components and Technology Conference; 巻数 2020-June). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC32862.2020.00346