An Origami-Structured Flexible Electronic Substrate with Faces Parallel to Target-of-Attachment Surfaces

Hiroki Yasuga, Atsushi Eda, Kai Suto, Tomohiro Tachi, Eiji Iwase

研究成果: Conference contribution

抄録

We propose a flexible electronic substrate structured by Origami folding of non-stretchable film with faces parallel to target-of-attachment surfaces. A folding ('Origami') or cutting ('Kirigami') of a thin film have opened up the application of non-stretchable materials to flexible electronic devices attached to a curved surface. In this paper, we propose origami-structured flexible electronic substrates which have faces parallel to the target-of-attachment surface. The parallel faces have engineering importance and usefulness for taking direct contact with target-of-attachment surfaces and mounting electronic elements, e.g. sensors or light emitters. These characteristics are expected to allow for the realization of flexible devices capable of sensing shear force or flow velocity parallel to object's surfaces.

本文言語English
ホスト出版物のタイトル33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020
出版社Institute of Electrical and Electronics Engineers Inc.
ページ909-912
ページ数4
ISBN(電子版)9781728135809
DOI
出版ステータスPublished - 2020 1
イベント33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020 - Vancouver, Canada
継続期間: 2020 1 182020 1 22

出版物シリーズ

名前Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
2020-January
ISSN(印刷版)1084-6999

Conference

Conference33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020
CountryCanada
CityVancouver
Period20/1/1820/1/22

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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