Analyses of transient behaviors of no-insulation REBCO pancake coils during sudden discharging and overcurrent

Tao Wang, So Noguchi, Xudong Wang, Issei Arakawa, Katsuhiko Minami, Katsutoshi Monma, Atsushi Ishiyama, Seungyong Hahn, Yukikazu Iwasa

研究成果: Article査読

116 被引用数 (Scopus)

抄録

Stability margin of a high-temperature superconducting (HTS) coil is two or three orders of magnitude greater than that of a low-temperature superconducting coil. In recent years, many papers have reported test results of turn-to-turn no-insulation (NI) HTS coils having extremely enhanced thermal stability, such that burnout never occurs in an NI coil, even at an operating current exceeding 2.5 times the critical current. Thus, The main goal of this paper is to clarify transient electromagnetic and thermal behaviors and mechanism of the high thermal stability in an NI REBCO coil. A partial element equivalent circuit (PEEC) model is proposed for the numerical simulation of an NI REBCO coil, which considers a local electrical contact resistance between turns, an $I\mbox{ - } V$ characteristic of an REBCO tape, and local self and mutual inductances of the NI REBCO coil. Using the PEEC model, we investigate the influence of the turn-to-turn contact resistance on the transient behavior of the NI REBCO coil during sudden discharging. We also perform thermal conduction analyses with the PEEC model to clarify the transient behavior of an NI REBCO coil during an overcurrent operation.

本文言語English
論文番号7010920
ジャーナルIEEE Transactions on Applied Superconductivity
25
3
DOI
出版ステータスPublished - 2015 6月 1

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 凝縮系物理学
  • 電子工学および電気工学

フィンガープリント

「Analyses of transient behaviors of no-insulation REBCO pancake coils during sudden discharging and overcurrent」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル