Anodic bonding below 180 °C for packaging and assembling of MEMS using lithium aluminosilicate-β-quartz glass-ceramic

Shuichi Shoji*, Hiroto Kikuchi, Hirotaka Torigoe

*この研究の対応する著者

研究成果査読

21 被引用数 (Scopus)

抄録

Silicon-to-glass anodic bonding is performed at temperature below 180 °C using lithium aluminosilicate - β-quartz glass-ceramic. High alkaline ion mobility at low temperature which is required for bonding and thermal expansion coefficient matching to Si is realized by controlling the composition of the glass-ceramic. Bonding is obtained at the lowest temperature of 140 °C. Useful bonding conditions are temperature above 160 °C (applied voltage of above 500 V). Since the etch rate of the glass-ceramic is five times higher than that of Pyrex glass in HF wet etching and the undercut is very small with Cr-Au etch mask, three dimensional structures are easily fabricated. Low temperature anodic bonding using this type of glass-ceramic is useful for the packaging and assembling of MEMS.

本文言語English
ページ482-487
ページ数6
出版ステータスPublished - 1997 1 1
イベントProceedings of the 1997 10th Annual International Workshop on Micro Electro Mechanical Systems, MEMS - Nagoya, Jpn
継続期間: 1997 1 261997 1 30

Other

OtherProceedings of the 1997 10th Annual International Workshop on Micro Electro Mechanical Systems, MEMS
CityNagoya, Jpn
Period97/1/2697/1/30

ASJC Scopus subject areas

  • 制御およびシステム工学
  • 機械工学
  • 電子工学および電気工学

フィンガープリント

「Anodic bonding below 180 °C for packaging and assembling of MEMS using lithium aluminosilicate-β-quartz glass-ceramic」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル