抄録
Silicon-to-glass anodic bonding is performed at temperature below 180 °C using lithium aluminosilicate - β-quartz glass-ceramic. High alkaline ion mobility at low temperature which is required for bonding and thermal expansion coefficient matching to Si is realized by controlling the composition of the glass-ceramic. Bonding is obtained at the lowest temperature of 140 °C. Useful bonding conditions are temperature above 160 °C (applied voltage of above 500 V). Since the etch rate of the glass-ceramic is five times higher than that of Pyrex glass in HF wet etching and the undercut is very small with Cr-Au etch mask, three dimensional structures are easily fabricated. Low temperature anodic bonding using this type of glass-ceramic is useful for the packaging and assembling of MEMS.
| 本文言語 | English |
|---|---|
| ページ | 482-487 |
| ページ数 | 6 |
| 出版ステータス | Published - 1997 1月 1 |
| イベント | Proceedings of the 1997 10th Annual International Workshop on Micro Electro Mechanical Systems, MEMS - Nagoya, Jpn 継続期間: 1997 1月 26 → 1997 1月 30 |
Other
| Other | Proceedings of the 1997 10th Annual International Workshop on Micro Electro Mechanical Systems, MEMS |
|---|---|
| City | Nagoya, Jpn |
| Period | 97/1/26 → 97/1/30 |
ASJC Scopus subject areas
- 制御およびシステム工学
- 機械工学
- 電子工学および電気工学