Application of I-structure though-glass interconnect filled with submicron gold particles to a hermetic sealing device

Kazuya Nomura, Akiko Okada, Shuichi Shoji, Toshinori Ogashiwa, Jun Mizuno

研究成果: Article査読

4 被引用数 (Scopus)

抄録

We propose hermetic sealing of a glass-to-glass structure with an I-structure through-glass interconnect via (TGV) filled with submicron Au particles. The top and bottom bumps and the TGV were formed by a simple filling process with a bump-patterned dry film resist. The sealing devices consisting of two glass substrates were bonded via Au interlayers. Vacuum ultraviolet irradiation in the presence of oxygen gas (VUV/O3) pretreatment was used for low-temperature Au-Au bonding at 200 °C. The bonded samples showed He leakage rates of less than 1.3 × 10-9 Pa m3 s-1. The cross-sectional scanning electron microscope images of the fabricated I-structure TGV showed perfect adhesion between the I-structure TGV and glass substrate. These results indicate that the proposed I-structure TGV is suitable for hermetic sealing devices.

本文言語English
論文番号105018
ジャーナルJournal of Micromechanics and Microengineering
26
10
DOI
出版ステータスPublished - 2016 9 19

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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