Athermal Silicon photonic devices using hybrid polymer cladding

Tomohiro Kita, Freddy Susanto Tan, Okihiro Sugihara, Hirohito Yamada, Toshikuni Kaino

研究成果: Paper査読

抄録

The compensation of sensitivity for ambient temperature is big issue to realize Silicon photonic integrated circuits. The large positive thermo-optic coefficient of Silicon core was cancelled by the negative thermooptic coefficient of hybrid polymer cladding including rutile TiO2 nanoparticles. The athermal waveguide structure with Silicon core and Hybrid polymer cladding was designed by numerical calculation.

本文言語English
ページ272-275
ページ数4
出版ステータスPublished - 2014 1 1
外部発表はい
イベント23rd International Conference on Plastic Optical Fibers, POF 2014 - Hiyoshi, Yokohama, Japan
継続期間: 2014 10 82014 10 10

Other

Other23rd International Conference on Plastic Optical Fibers, POF 2014
CountryJapan
CityHiyoshi, Yokohama
Period14/10/814/10/10

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Materials Chemistry
  • Polymers and Plastics

フィンガープリント 「Athermal Silicon photonic devices using hybrid polymer cladding」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル