Athermal Silicon photonic devices using hybrid polymer cladding

Tomohiro Kita; Freddy Susanto Tan; Okihiro Sugihara; Hirohito Yamada; Toshikuni Kaino

Athermal Silicon photonic devices using hybrid polymer cladding

Tomohiro Kita, Freddy Susanto Tan, Okihiro Sugihara, Hirohito Yamada, Toshikuni Kaino

研究成果: Paper › 査読

抄録

The compensation of sensitivity for ambient temperature is big issue to realize Silicon photonic integrated circuits. The large positive thermo-optic coefficient of Silicon core was cancelled by the negative thermooptic coefficient of hybrid polymer cladding including rutile TiO₂ nanoparticles. The athermal waveguide structure with Silicon core and Hybrid polymer cladding was designed by numerical calculation.

本文言語	English
ページ	272-275
ページ数	4
出版ステータス	Published - 2014 1 1
外部発表	はい
イベント	23rd International Conference on Plastic Optical Fibers, POF 2014 - Hiyoshi, Yokohama, Japan 継続期間: 2014 10 8 → 2014 10 10

Other

Other	23rd International Conference on Plastic Optical Fibers, POF 2014
Country	Japan
City	Hiyoshi, Yokohama
Period	14/10/8 → 14/10/10

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Materials Chemistry
Polymers and Plastics

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引用スタイル

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title = "Athermal Silicon photonic devices using hybrid polymer cladding",

abstract = "The compensation of sensitivity for ambient temperature is big issue to realize Silicon photonic integrated circuits. The large positive thermo-optic coefficient of Silicon core was cancelled by the negative thermooptic coefficient of hybrid polymer cladding including rutile TiO2 nanoparticles. The athermal waveguide structure with Silicon core and Hybrid polymer cladding was designed by numerical calculation.",

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AU - Kita, Tomohiro

AU - Tan, Freddy Susanto

AU - Sugihara, Okihiro

AU - Yamada, Hirohito

AU - Kaino, Toshikuni

PY - 2014/1/1

Y1 - 2014/1/1

N2 - The compensation of sensitivity for ambient temperature is big issue to realize Silicon photonic integrated circuits. The large positive thermo-optic coefficient of Silicon core was cancelled by the negative thermooptic coefficient of hybrid polymer cladding including rutile TiO2 nanoparticles. The athermal waveguide structure with Silicon core and Hybrid polymer cladding was designed by numerical calculation.

AB - The compensation of sensitivity for ambient temperature is big issue to realize Silicon photonic integrated circuits. The large positive thermo-optic coefficient of Silicon core was cancelled by the negative thermooptic coefficient of hybrid polymer cladding including rutile TiO2 nanoparticles. The athermal waveguide structure with Silicon core and Hybrid polymer cladding was designed by numerical calculation.

KW - Hybrid polymer

KW - Silicon photonics

KW - Thermo-optic effect

KW - TiO nanoparticles

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