BACKSCATTERING FACTOR IN Au-Cu ALLOYS FOR QUANTITATIVE ANALYSIS BY SCANNING AUGER ELECTRON MICROSCOPY.

S. Ichimura, R. Shimizu, T. Ikuta

研究成果: Article査読

2 被引用数 (Scopus)

抄録

This work was attempted to examine the validity of the backscattering factors by applying them to the quantitative Auger analysis of sputter-deposited Ni-Pt layer which is probably the most appropriate test sample of known concentration for surface analysis. The surface composition of the sputter-deposited layer determined by this quantitative analysis method agrees well with the bulk composition of sputter Ni-Pt sample. Then this approach was applied to study preferential sputtering in Au-Cu alloys. The surface composition of sputtered Au-Cu alloy sample, which is quantified similar to the Ni-Pt alloy, is in very good agreement with the bulk composition of the sputtered Au-Cu alloy.

本文言語English
ページ(範囲)231-236
ページ数6
ジャーナルScanning Electron Microscopy
出版ステータスPublished - 1981 1 1
外部発表はい

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Biophysics

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