Behavior of Evaporated Palladium Catalyst for Electroless Nickel-Phosphorus Film Formation

Tetsuya Osaka, Lchiro Koiwa

研究成果: Article査読

12 被引用数 (Scopus)

抄録

Vacuum-evaporated palladium was used as catalyst for electroless Ni-P deposition on polyimide and alumina substrates. The effect that varying amounts of Pd had on the early stages of electroless plating was investigated by means of Rutherford backscattering spectrometry and transmission electron microscopy. No significant diffusion of the catalyst into the Ni-P film was observed; in some cases, a small amount of Pd tended to diffuse into the deposited Ni-P film, particularly on polyimide substrates. The deposition rate of the Ni-P film on polyimide was always less than that on alumina. An increased amount of catalyst decreased the deposition rate significantly without altering the stoichiometry of the plated film. When less than 10l6 Pd at./cm2 were evaporated onto the substrate, the catalyst formed clusters of palladium particles on the surface, whereas larger amounts of Pd (e.g., 2 x 1016 at./cm2) settled as a continuous film at the substrate.

本文言語English
ページ(範囲)2081-2084
ページ数4
ジャーナルJournal of the Electrochemical Society
132
9
DOI
出版ステータスPublished - 1985 9

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 再生可能エネルギー、持続可能性、環境
  • 表面、皮膜および薄膜
  • 電気化学
  • 材料化学

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