Bonding properties of low-temperature wafer bonding using sub-micron gold particles with different particle sizes

Hiroyuki Ishida*, Toshinori Ogashiwa, Yukio Kanehira, Shin Ito, Takuya Yazaki, Shuichi Shoji, Jun Mizuno

*この研究の対応する著者

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

Low-temperature wafer bonding using sub-micron gold particles was investigated. Wafer-level pattern transfer method has also been developed to enable patterning on wafers with fragile structures such as MEMS devices. Sub-micron Au particle patterns with a width of 20 μm - 60 μm and a height around 20 μm were formed on 100mm-diameter glass wafers by means of wafer-level processing using photolithography and a slurry-filling technique, and then successfully transferred onto Si wafers in ambient atmosphere at a temperature of 150°C and an applied pressure of 20 MPa - 30 MPa. Wafer bonding was performed at 200°C, 100 MPa and exhibited a sufficient tensile strength of 45.8 MPa. A good hermeticity was also confirmed as He leak rate of < 1 × 10-9 Pa·m3/s. Compression deformation measurement was performed for patterns with different mean particle sizes of 0.3μm and 0.1μm and the performance on a-few-μm surface roughness absorption was demonstrated. Patterns with smaller size particles showed larger deformation, or more ability to absorb surface opography.

本文言語English
ホスト出版物のタイトル2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Proceedings
ページ167-170
ページ数4
DOI
出版ステータスPublished - 2012 12 1
イベント2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Taipei, Taiwan, Province of China
継続期間: 2012 10 242012 10 26

出版物シリーズ

名前Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
ISSN(印刷版)2150-5934
ISSN(電子版)2150-5942

Conference

Conference2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012
国/地域Taiwan, Province of China
CityTaipei
Period12/10/2412/10/26

ASJC Scopus subject areas

  • ハードウェアとアーキテクチャ
  • 制御およびシステム工学
  • 電子工学および電気工学

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