Breakdown strength at the interface between epoxy resin and silicone rubber

Kohei Shibata*, Y. Ohki, T. Takahashi, T. Okamoto

*この研究の対応する著者

研究成果: Conference article査読

2 被引用数 (Scopus)

抄録

We have proposed a concept of an environment-conscious all-solid-insulated substation system as a next generation substation. In order to make the system compact and its layout flexible, it is required to develop a compact connection system with solid insulating materials. Hard and soft insulating materials are to be used for this connection system. Therefore, there is a concern about air penetration into their interface at the time of connection, which reduces the insulation performance. In order to simulate this situation, a model connection part was made using an epoxy resin board as the hard material and a silicone rubber board as the soft material with a spacer inserted into their interface. The present paper reports experimental results on the breakdown strength under ac and impulse voltages. It is confirmed that the insulation performance decreases with an increase in the thickness of the air layer between the two boards.

本文言語English
ページ(範囲)289-292
ページ数4
ジャーナルConference on Electrical Insulation and Dielectric Phenomena (CEIDP), Annual Report
出版ステータスPublished - 2003 11 21
イベント2003 Annual Report: Conference on Electrical Insulation and Dieletric Phenomena - Albuquerque, NM, United States
継続期間: 2003 10 192003 10 22

ASJC Scopus subject areas

  • 建築および建設
  • 産業および生産工学
  • 電子工学および電気工学

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