Broadband planar integration and packaging for millimeter-wave circuit design at the V-band

Ki Seok Yang*, Sung Tae Choi, Kiyohito Tokuda, Yong Hoon Kim

*この研究の対応する著者

研究成果: Article査読

4 被引用数 (Scopus)

抄録

A broadband planar integration and packaging of millimeter-wave circuits based on the integrated waveguide (IWG) and grounded coplanar waveguide (GCPW) transitions are proposed and demonstrated at the V-band. A novel wideband microstrip-line-to-IWC transition is proposed for the planar integration of the rectangular waveguide devices and the insertion loss per one transition is less than 0.1 dB from 43 to 73 GHz. A proposed surface-mountable filter has an insertion loss of 3 dB and a 3.3% bandwidth at a center frequency of 62 GHz. A broadband ribbon interconnection exhibits law loss of 0.2 dB from DC to 70 GHz and the insertion loss of a single microstrip-to-waveguide transition is less than 0.4 dB from 50 to 75 GHz.

本文言語English
ページ(範囲)371-374
ページ数4
ジャーナルMicrowave and Optical Technology Letters
44
4
DOI
出版ステータスPublished - 2005 2 20
外部発表はい

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 原子分子物理学および光学
  • 凝縮系物理学
  • 電子工学および電気工学

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