Cepstrum technique for multilayer structure characterization

X. M. Lu, J. M. Reid, K. Soetanto, L. Weng, V. Genis

研究成果: Conference article査読

4 被引用数 (Scopus)

抄録

The triple cepstrum, the third power of the inverse Fourier transform (IFT) of the logarithm of signal power spectrum, is used to characterize two-layer structures. The thickness of each layer can be found from the positions of the peaks in the triple cepstrum. Simulations and preliminary experiments have shown that the relative reflection coefficients can be reconstructed, in the ideal and lossless case, from the polarity and the amplitude of these peaks, as predicted by theory. The impedance pattern can be predicted even at low signal to noise ratio. A potential application of this method is to characterize blood vessel walls. The resulting thickness and impedance pattern could be useful in detecting and classifying plaques, particularly in the early stages.

本文言語English
ページ(範囲)1571-1574
ページ数4
ジャーナルUltrasonics Symposium Proceedings
3
出版ステータスPublished - 1990 12 1
外部発表はい
イベントProceedings of the IEEE 1990 Ultrasonics Symposium - Honolulu, HI, USA
継続期間: 1990 12 41990 12 7

ASJC Scopus subject areas

  • Engineering(all)

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