Characterization of low temperature bonding with Cu nanoparticles for electronic packaging application

Jianfeng Yan*, Guisheng Zou, Xiaoyu Wang, Fengwen Mu, Hailin Bai, Aiping Wu, Anming Hu, Y. Norman Zhou

*この研究の対応する著者

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

Tin-lead alloys are widely used as solder in the electronics industry. For concerns of environment and human health, it is necessary to develop new bonding method using Pb-free material for microelectronic packaging. There have been some reports about low temperature bonding using Ag nanoparticles. Compared with Ag nanoparticles, Cu nanoparticles have some advantages, such as low cost and good ionic migration property. In this study we report a low temperature bonding process using Cu nanoparticles. The polymer coated on the surface of Cu nanoparticles can protect them from oxidation. Strong joints were formed at bonding temperatures as low as 180°C under 5MPa in air atmosphere. This novel sintering-bonding technology using Cu nanoparticles as interconnection material has a potential application for electronic packaging.

本文言語English
ホスト出版物のタイトルMaterials Science and Technology Conference and Exhibition 2011, MS and T'11
ページ1526-1531
ページ数6
出版ステータスPublished - 2011 12 1
外部発表はい
イベントMaterials Science and Technology Conference and Exhibition 2011, MS and T'11 - Columbus, OH, United States
継続期間: 2011 10 162011 10 20

出版物シリーズ

名前Materials Science and Technology Conference and Exhibition 2011, MS and T'11
2

Conference

ConferenceMaterials Science and Technology Conference and Exhibition 2011, MS and T'11
国/地域United States
CityColumbus, OH
Period11/10/1611/10/20

ASJC Scopus subject areas

  • 材料科学(全般)

フィンガープリント

「Characterization of low temperature bonding with Cu nanoparticles for electronic packaging application」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル