Reversible adhesion has long been of significant practical interest for a range of applications including controllable adhesion, photolithography, temporary bonding required for wound dressings and certain manufacturing processes, and disassembly for repairing and recycling. UV degradable materials find applications in medical and microelectronic fields due to their dramatic property changes after UV irradiation, allow for easy removal of the adhesive. A series of UV cleavable adhesives has been synthesized to investigate their ability to debond more readily as a function of UV radiation dosage. In this paper a wedge test, from elevated temperature exposure or photo-degradation, is used to measure the reduction in resistance to debonding. By using fracture mechanics principles and recording the growing debond length as a function of exposure, the fracture energy can be determined. Tests are conducted to measure how fracture energy decreases after varying amounts of thermal exposure or UV irradiation. The debond surfaces and locus of failure are also investigated in this study.