Characterizing temporary bonding adhesives using a wedge test

L. Yan, T. Suga, S. M. June, T. E. Long*, D. A. Dillard

*この研究の対応する著者

研究成果: Conference contribution

抄録

Reversible adhesion has long been of significant practical interest for a range of applications including controllable adhesion, photolithography, temporary bonding required for wound dressings and certain manufacturing processes, and disassembly for repairing and recycling. UV degradable materials find applications in medical and microelectronic fields due to their dramatic property changes after UV irradiation, allow for easy removal of the adhesive. A series of UV cleavable adhesives has been synthesized to investigate their ability to debond more readily as a function of UV radiation dosage. In this paper a wedge test, from elevated temperature exposure or photo-degradation, is used to measure the reduction in resistance to debonding. By using fracture mechanics principles and recording the growing debond length as a function of exposure, the fracture energy can be determined. Tests are conducted to measure how fracture energy decreases after varying amounts of thermal exposure or UV irradiation. The debond surfaces and locus of failure are also investigated in this study.

本文言語English
ホスト出版物のタイトル12th International Conference on Fracture 2009, ICF-12
ページ6347-6355
ページ数9
出版ステータスPublished - 2009 12 1
外部発表はい
イベント12th International Conference on Fracture 2009, ICF-12 - Ottawa, ON, Canada
継続期間: 2009 7 122009 7 17

出版物シリーズ

名前12th International Conference on Fracture 2009, ICF-12
8

Conference

Conference12th International Conference on Fracture 2009, ICF-12
国/地域Canada
CityOttawa, ON
Period09/7/1209/7/17

ASJC Scopus subject areas

  • 地盤工学および土木地質学

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