Comparison of Thermal Degradation Between Soft and Hard Epoxy Resins

Yoshimichi Ohki*, Hiroyuki Ishii, Naoshi Hirai

*この研究の対応する著者

研究成果: Conference contribution

抄録

Soft epoxy resin with rubber-based additives and ordinary hard epoxy resin, both used as electrical insulators and airtight sealants in electrical penetrations in nuclear power plants (NPPs), were heated in air at various temperatures to simulate their thermal aging. They were then subjected to mechanical and dielectric tests. The soft epoxy resin becomes hard, while its permittivity and loss factor decrease as the heating becomes longer. By these changes, the soft resin tends to exhibit similar behavior in various properties to those of the original unaged hard one. Since its behavior becomes close to the hard one, it can be usable in NPPs. On the other hand, the hard one is hardly affected by the thermal aging.

本文言語English
ホスト出版物のタイトルICD 2022 - IEEE 2022 4th International Conference on Dielectrics, Proceedings
出版社Institute of Electrical and Electronics Engineers Inc.
ページ485-488
ページ数4
ISBN(電子版)9781665418331
DOI
出版ステータスPublished - 2022
イベント4th IEEE International Conference on Dielectrics, ICD 2022 - Palermo, Italy
継続期間: 2022 7月 32022 7月 7

出版物シリーズ

名前ICD 2022 - IEEE 2022 4th International Conference on Dielectrics, Proceedings

Conference

Conference4th IEEE International Conference on Dielectrics, ICD 2022
国/地域Italy
CityPalermo
Period22/7/322/7/7

ASJC Scopus subject areas

  • 電子工学および電気工学
  • ポリマーおよびプラスチック

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