Condition optimization, reliability evaluation of SiO2-SiO2 HF bonding and its application for UV detection micro flow cell

H. Nakanishi*, T. Nishimoto, M. Kanai, T. Saitoh, R. Nakamura, T. Yoshida, S. Shoji

*この研究の対応する著者

研究成果: Conference article査読

38 被引用数 (Scopus)

抄録

In order to apply SiO2-SiO2 bonding with hydrofluoric acid (HF bonding) for micro-electro-mechanical systems (MEMS) fabrication, the optimal bonding conditions were examined under different temperature, HF concentration and bonding time. The necessary HF concentration and the necessary time for bonding are reduced by elevating the bonding temperature. The time for bonding was reduced from 24 h at room temperature to 30 min at 80 °C, 60 min at 60 °C under the conditions of 0.5 wt.% HF concentration and 1.3 MPa applied pressure. The bonding time is comparable to that of anodic bonding. Reliability of the HF bonding was confirmed by the results of temperature cyclic tests and thermal shock tests. A long term stability of the bonded sample was also evaluated by helium (He) leak detection. The measured He leak rate was less than 2.0×10-9 atm cm3/s which is much smaller than that calculated value through component materials of the sample. A novel quartz UV detection micro flow cell for chemical analysis having Si shade structure was fabricated by the HF bonding. The absorbance unit for UV absorption detection of the cell was improved remarkably.

本文言語English
ページ(範囲)136-141
ページ数6
ジャーナルSensors and Actuators, A: Physical
83
1
DOI
出版ステータスPublished - 2000 5 22
イベントThe 10th International Conference on Solid-State Sensors and Actuators TRANSDUCERS '99 - Sendai, Jpn
継続期間: 1999 6 71999 6 10

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 器械工学
  • 凝縮系物理学
  • 表面、皮膜および薄膜
  • 金属および合金
  • 電子工学および電気工学

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